Silicon Packaging Architect / Engineer

Intel • Hillsboro, CA

3d • Onsite

About The Position

The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful. About This Opportunity: Join Intel's Wireless Communications Solutions (WCS) team during an exciting period of innovation and new development opportunities. WCS focuses on developing advanced wireless technologies and solutions that enable seamless connectivity across a wide range of devices and platforms. The group specializes in wireless communication products including Wi-Fi, Bluetooth, and emerging wireless standards, delivering high-performance, reliable, and secure wireless solutions. WCS drives innovation in wireless connectivity by integrating cutting-edge hardware and software technologies to meet the evolving needs of consumers and enterprise customers. The business unit ensures regulatory compliance and quality through rigorous product regulatory life cycle management aligned with Intel's global standards and country-specific requirements. WCS is committed to advancing wireless communication capabilities, supporting Intel’s leadership in the wireless ecosystem, and enabling next-generation connected experiences. As a Silicon Packaging Architect/Engineer, you'll drive cutting-edge semiconductor packaging technology and architecture for WiFi, Bluetooth, and mmWave products, focusing on RF/Electrical, Thermal, Mechanical, Reliability, and Cost optimization.

Requirements

• Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science/Engineering, Physics, or related field + 4+ years industry experience OR Master's degree in relevant field + 3+ years experience OR PhD in relevant field + 1+ years experience
• 2+ years package assembly technology development experience
• 2+ years packaging physics (mechanical and thermal) and/or materials experience
• 2+ years package assembly manufacturing processes and HVM ramp experience
• Strong project management capabilities
• Proficiency in Microsoft Office Suite
• Excellent communication and presentation abilities
• Self-driven with strong problem-solving tenacity
• Action-oriented mindset

Nice To Haves

• Semiconductor device physics and process engineering experience
• RF Component Packaging experience (highly valued for wireless products)
• Testing systems experience with hardware/software (Matlab, LabView

Responsibilities

• Translate product requirements into comprehensive package architecture specifications
• Lead technology trade-off decisions ensuring packages meet electrical, mechanical, thermal, and reliability standards
• Define overall product package performance specifications and drive technology certification
• Oversee end-to-end package development processes, from design through production
• Troubleshoot complex packaging problems and develop innovative, cost-effective solutions
• Research packaging assembly materials and properties, establishing specifications for suppliers
• Perform mechanical and reliability simulations to optimize package design
• Conduct thermal performance simulations using predictive FEA analysis
• Partner with silicon, hardware, and package design teams to ensure high-quality deliverables
• Coordinate with internal/external manufacturing partners (OSATs) and substrate suppliers
• Support product co-design and layout teams as manufacturing liaison
• Collaborate with Quality & Reliability teams to ensure products meet specifications
• Complete DFMEA assessments with assembly suppliers to evaluate technology risks
• Ensure seamless transition from design to high-volume production
• Design and validate Test Vehicles for process characterization
• Provide consultation on packaging improvements and process optimization

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel .

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees