Signal and Power Integrity Engineer

Google•Sunnyvale, CA

7h•$156,000 - $229,000

About The Position

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration. As a Chip Package SI/PI Engineer, you will be responsible for the chip package design with signal/power integrity simulation and characterization in the chip, package and system level. Within a concurrent engineering environment, you will be the main part of a larger team with system architects, ASIC engineers, and other SI/PI engineers. You will work with multi cross-functional teams including chip design team, board design team, system design team as well as vendors. You will drive chip packaging signal and power implementations to meet chip, package and system electrical requirements. The ML, Systems, & Cloud AI (MSCA) organization at Google designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all Google services (Search, YouTube, etc.) and Google Cloud. Our end users are Googlers, Cloud customers and the billions of people who use Google services around the world. We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Google Cloud’s Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.

Requirements

Bachelor's degree in Mechanical, Material, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience.
4 years of experience in SI/PI design for chip/package or system PCB.
Experience in industry SIPI modeling tool chains (e.g., HFSS, ADS, Sigrity, Siwave, etc.).

Nice To Haves

Master's degree or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
Signal and power integrity experience with various high speed interconnects (e.g., HBMx, D2D, Ethernet, PCIe, etc.).
Experience with 2.5D/3D package design such as silicon interposer, silicon bridge, 3D die stacking.
Cross-functional experience and co-design with chip top design, physical design, STA, package, system and validation teams.
Familiar with post SI test environment on memory or high speed serdes.
Proficient programming skill and data analysis skill with MATLAB, python, C++, etc. to establish automation flows and data processing.

Responsibilities

Drive SI/PI analysis and optimization for HPC based on 2.5D/3D technology, influencing product definition, chip floorplan, power tree structures, and netlists.
Lead the development of next-generation memory interfaces and evaluate high-speed Interface IP, considering IO PHY, physical design, and SI/PI requirements.
Manage Post-Silicon validation and qualification of high-speed interfaces for New Product Introduction (NPI), ensuring performance meets production standards.
Partner with chip/system design teams and external vendors to define SI/PI design targets, set chip boundaries, and balance SI/PI and DFM tradeoffs for production closure.
Develop innovative methodologies to enhance simulation accuracy and productivity while providing critical feedback on chip floorplans to optimize routability and signal integrity.