About The Position

General Summary: Join the exciting Hardware Customer Engineering team supporting the latest 5G cellular modem based products in Telematics for one of the World’s largest Fabless Semiconductor companies. Use your versatile technical and communication skills to enable significant product launches by working closely with customers and internal design teams. Telematics product support includes developing & delivering world-class documentation, customer training, design reviews, design examples and debugging. You will gain exposure to a broad range of state-of-the-art technical and business topics including but not limited to: Product design, System design (Thermal Power, PDN, Signal Integrity, & High Speed SerDes), Embedded Processors (CPUs, DSPs) Memory & Peripherals (DDR, eMMC, USB, PCIe, SGMII, RGMII, NAND, SDC, etc.) and related Business topics (marketing support, training & legal topics). The Telematics hardware applications team provides comprehensive support to all Telematics system-on-chip (SoC) products. You will interface with cross-functional internal teams and global applications engineering teams to provide end-to-end customer support ranging from customer training, development and commercialization support, to mass production. We are looking for inquisitive, highly motivated team players with excellent communication skills and an understanding of SoC’s, high speed PCB design and wireless systems. You will also help bridge customer requirements with internal plan of record, identify gaps in requirements, and propose solutions to mitigate the gaps.

Requirements

  • Bachelor's degree in Electrical/Electronics Engineering, Computer Engineering, or related field and 2+ years of Hardware Applications Engineering or Hardware Design experience or related work experience.
  • OR Master's degree in Electrical/Electronics Engineering, Computer Engineering, or related field and 1+ year of Hardware Applications Engineering or Hardware Design experience or related work experience.
  • OR PhD in Electrical/Electronics Engineering, Computer Engineering, or related field.
  • Excellent verbal and written communication skills to convey complex and/or detailed information to multiple individuals/audiences with differing knowledge levels.
  • Familiarity with complex multi-layered PCB design, schematic, and layout, including power and signal integrity.
  • Self-motivated, independent, and works well with large interdisciplinary teams.
  • Experience in finding the root cause of hardware system issues.
  • Experience in integration, debug, and problem reproduction on internal and customer platforms.

Nice To Haves

  • Master's Degree in Electrical/Electronic Engineering, Computer Engineering or related field.
  • 2+ years Hardware Design or Hardware Applications experience or related work experience.
  • Familiar with Principals of High Speed PCB Design including transmission lines, pcb stack-up, controlled impedance and PDN
  • Familiar with SoC interfaces such as LPDDR, MIPI, USB, PCIe, SGMII, RGMII

Responsibilities

  • Provide hardware design support to customers to enable efficient high quality product launches focusing on Baseband digital interfaces
  • Research and answer a wide range of in-depth technical questions on Qualcomm SoC’s and associated memory, peripherals and IOs (e.g., LPDDR, eMMC, USB, PCIe, SGMII, RGMII)
  • Resolve technical problems via hands-on trouble shooting.
  • Perform block diagram, schematic, parts placement, and PCB routing reviews on customer platforms, including DDR, Power Delivery Network, and Signal Integrity simulations.
  • Create/Contribute to customer facing Hardware design examples.
  • Create and maintain world-class hardware documentation and design collateral.
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