About The Position

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world. The Advanced Effector Guidance Systems Department provides Electrical Systems Engineering to develop Guidance Electronics solutions for products across the Raytheon portfolio. Our team develops missile Guidance Electronics Hardware. Our core electrical engineering responsibilities include architecture, requirements, integration, and test. Our core electrical engineering technologies include RF/RADAR, Navigation/IMU/GPS, Digital, and Power. We partner with several Electrical Product Team departments that provide the detailed design of our electrical products as well as missile level systems teams. The Advanced Effector Guidance Systems Department is searching for a Senior Principal Systems Integration Lead with experience in hardware design and verification, electrical architecture and system requirement verification. The role of the Electrical Systems Lead is to manage a cross-functional and cross-discipline team of engineers through product development and integration for both subsystems and overall system level. The Electrical System Lead provides both technical guidance and supervision in meeting project commitments and leading the team through critical design reviews. They also manage suppliers and may lead proposal development efforts.

Requirements

  • Typically requires a Bachelor’s Degree in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 10 years of prior relevant experience
  • Experience with electrical hardware development, sub-systems, systems engineering, requirement development and/or requirement validation
  • Active and transferable U.S. government issued security clearance is required prior to start date.

Nice To Haves

  • Missile guidance electronics subsystems typically contain antennas, analog RF circuit cards, digital circuit cards, and configurable logic so the ideal candidate will have a background in designing and troubleshooting of one or more of these components.
  • Ideal candidates will also have experience in project leadership, systems engineering and architecture and have a desire to grow into a higher level.
  • Experience working with missiles or similar systems.
  • Experience in Earn Value Management System (EMVS) and Cost Account Management (CAM)
  • Knowledge of mixed signal electronics.
  • Ability to manage and lead cross-functional teams.
  • Ability to drive suppliers in meeting commitments.
  • Ability to resolve technical issues efficiently.
  • Experience working in system level integration spread benches.
  • Knowledge of testing and integrating subsystems and system level for verifying functionality and environments.
  • Practical experience in circuit card assembly design, manufacturing process, and test.
  • Knowledge of DOD Hardware development process (knowledge of design gates).
  • Experience in all phases of the product development lifecycle.
  • Experience in developing proposals.
  • Knowledge and/or experience with Model Based System Engineering (MBSE)

Responsibilities

  • Work environment is primarily in an office, but may include labs, field work, or a combination.
  • Assignments may include guiding a team through several phases of hardware systems lifecycle such as designs and analysis; architecting new electronic systems; developing and documenting subsystem requirements and test plans; peer reviews of designs as a subject matter expert; presentations to peers, management, and government customers; and root-cause failure investigations.
  • Missile Systems has a strong culture of mentoring; it is expected that employees will be both mentors and mentees.
  • Assignments may require supporting multiple programs or multiple programs’ portfolio.
  • Assignments may require some travel, including foreign travel.
  • Assignments may require technical knowledge of the various system level configurations.
  • Assignments may require technical knowledge of each subsystem within the system.
  • Assignments may require understanding of the system interfaces within the electronics subsystems and system level architectural design.
  • Assignments may require understanding of the system’s timelines and system’s requirements.
  • Assignments may require solving complex technical issues within system level down to circuit card level designs.
  • Assignments may require leading failure investigation teams and to present failure investigation results to customers and higher-level management.
  • Assignments may require leading circuit card re-design or new design efforts.
  • Work within a multi-disciplined team.
  • Collaboration with both Functional and Program higher level management.
  • Collaboration with Customer and Suppliers.

Benefits

  • medical
  • dental
  • vision
  • life insurance
  • short-term disability
  • long-term disability
  • 401(k) match
  • flexible spending accounts
  • flexible work schedules
  • employee assistance program
  • Employee Scholar Program
  • parental leave
  • paid time off
  • holidays
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