Senior Principal Electronics Lead

RTXTucson, AZ
23hOnsite

About The Position

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world. The Advanced Effector Guidance Systems (AEGS) Department within Raytheon Hardware Engineering provides Electrical Systems Engineering to develop Electronic Systems solutions for products across the Raytheon portfolio. Our core electrical engineering responsibilities include architecture, requirements, integration, and test. Our core electrical engineering technologies include RF/RADAR, Navigation/IMU/GPS, Data Link/Communication, Digital, and Power. We partner with several Electrical Product Team departments that provide the detailed design of our electrical products as well as systems teams. The AEGS Department is searching for a Senior Principal Avionics Lead with experience leading a multi-disciplinary system design and integration team. The role of the Lead is to lead a cross-functional and cross-discipline team of engineers through the design cycle for development and integration.

Requirements

  • Typically requires a bachelor’s degree in science, Technology, Engineering, or Mathematics (STEM) and a minimum of 10 years of prior relevant experience unless prohibited by local laws/regulations
  • Ten years of experience in one or more of the following areas: Subassembly design, integration, and production support Analog, digital, and power electronics design, integration, and production support Deconvolving high level requirements into actionable design electronics and subsystem architectures
  • Experience in electrical sub-systems, systems engineering, requirement development, requirement validation, Circuit Card Assembly (CCA) Design, Test Integration, and/or Supplier Management on an effector-based product
  • Active and transferable U.S. government issued Secret security clearance is required prior to start date.
  • U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.

Nice To Haves

  • Prior experience as a technical leader on a complex subsystem during Engineering, Manufacturing, and Development (EMD) Phase
  • Advanced degree in mathematics, physics, or related engineering degrees.
  • Systems engineering thought process with analytical skills background.
  • Highly self-motivated individual that can perform multidiscipline work
  • Electrical subsystems typically contain antennas, analog circuit cards, digital circuit cards, and configurable logic so the ideal candidate will have a background in designing and troubleshooting of one or more of these components.
  • Ideal candidates will also have experience in project leadership, systems engineering and architecture and have a desire to grow to a higher level.
  • Able to network / influence outside of the AEGS Department with other design and production support organizations, program leadership, other engineering disciplines and Manufacturing organizations.
  • Interpersonal skills with the ability to interact positively with peers, suppliers, management, and customers in a production environment.
  • Proven experience in balancing engineering process discipline and innovation for rapid development and program success.
  • Experience working with missiles or similar systems.
  • Ability to effectively work multiple tasks and priorities.
  • Knowledge of mixed signal electronics.
  • Practical experience in all phases of the product development lifecycle.
  • Experience in developing proposals.
  • Experience leading large, complex trade studies
  • Experience developing and materializing conceptual designs and integrating them into a system of systems

Responsibilities

  • Responsible for Technical, Cost, and Schedule Execution.
  • Be responsible for the technical integrity of electronics, including the Technical Data Package (TDP) development, validation, and integration with Test Equipment (TE)
  • Manage costs and schedule for the design, verification, and hardware procurement
  • Manage technical risk for electronics
  • Technical oversight of failure investigations
  • Support component level design and test reviews
  • Work environment is primarily in an office, but may include labs, field work, or a combination. Assignments may include guiding a team through several phases of hardware systems lifecycle such as designs and analysis; architecting new electronic systems; developing and documenting subsystem requirements and test plans; peer reviews of designs as a subject matter expert; presentations to peers, management, and government customers; and root-cause failure investigations.
  • Manage transition to production and early Production units
  • Raytheon has a strong culture of mentoring; it is expected that employees will be both mentors and mentees.
  • Collaboration with both Functional and Program higher level management.
  • Collaboration with Customer and Suppliers.
  • Assignment may require some travel

Benefits

  • This position is 100% onsite in Tucson Arizona and qualifies for relocation assistance.
  • As part of our commitment to maintaining a secure hiring process, candidates may be asked to attend select steps of the interview process in-person at one of our office locations, regardless of whether the role is designated as on-site, hybrid or remote.
  • Hired applicants may be eligible for benefits, including but not limited to, medical, dental, vision, life insurance, short-term disability, long-term disability, 401(k) match, flexible spending accounts, flexible work schedules, employee assistance program, Employee Scholar Program, parental leave, paid time off, and holidays.
  • Specific benefits are dependent upon the specific business unit as well as whether or not the position is covered by a collective-bargaining agreement.
  • Hired applicants may be eligible for annual short-term and/or long-term incentive compensation programs depending on the level of the position and whether or not it is covered by a collective-bargaining agreement.
  • Payments under these annual programs are not guaranteed and are dependent upon a variety of factors including, but not limited to, individual performance, business unit performance, and/or the company’s performance.
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