Senior Microelectronics Packaging Engineer

Allegro MicroSystems•Manchester, NH

17d•Hybrid

About The Position

The Allegro team is united by a clear purpose—advancing technologies that make the world safer, more efficient, and more sustainable. With over 30 years of experience in semiconductor innovation, we bring that purpose to life across every part of the business—from breakthrough product development and customer success to how we show up for each other and the communities we serve. The Opportunity Develop robust and reliable packaging solutions for Allegro's cutting-edge sensor, power, and high-voltage power integrated circuits. Collaborate with cross-functional teams, including design, quality, reliability, and manufacturing, to ensure that package designs meet stringent performance, quality, and cost targets. Responsible for all aspects of package development, from initial concept and design through qualification, failure analysis, and high-volume production release. What You Will Do Design and develop integrated circuit packages, process flows, and materials supporting Sensor, Power, and High Voltage Power product development. Create AutoCAD drawings, 3D models, and detailed specifications for integrated circuit packages. Employ DFMEA and other Advanced Product Quality Process (APQP) methodologies to ensure designs meet project mission profiles and Allegro’s quality and reliability objectives. Collaborate with the Allegro quality and reliability team to design appropriate qualification and failure analysis plans for new packages. Analyze qualification data and support the transition of new packages into high-volume production. Manage project schedules and deliverables and maintain design documents and reports in SharePoint. Collaborate with cross-functional teams on new package development and optimization of existing high-volume production packages. Work closely with internal and external package assembly sites to verify in-process data and oversee pre-production manufacturing execution. Perform modeling and simulation using ANSYS and LS-DYNA for various semiconductor packages and processes. Conduct mechanical and thermal material characterizations using an Instron mechanical tester and Siemens T3ster. Create detailed technical reports and presentations for both technical and non-technical audiences. Hybrid office/home work schedule.

Requirements

Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Industrial and Systems Engineering and 5 years of experience with: working with package design for magnetic sensing and power IC applications; and Using AutoCAD and SolidWorks, as well as ANSYS and LS-DYNA simulation platforms.
Alternatively, will accept a Master’s degree in the same fields and 3 years of same experience.
As another alternative, will accept a Ph.D. in the same fields with specific coursework involving Materials Science and Engineering Fundamentals, including: Material Structure Analysis Metal Physics Solid State Physics Thermodynamics of Materials Fundamentals of Crystallography

Responsibilities

Design and develop integrated circuit packages, process flows, and materials supporting Sensor, Power, and High Voltage Power product development.
Create AutoCAD drawings, 3D models, and detailed specifications for integrated circuit packages.
Employ DFMEA and other Advanced Product Quality Process (APQP) methodologies to ensure designs meet project mission profiles and Allegro’s quality and reliability objectives.
Collaborate with the Allegro quality and reliability team to design appropriate qualification and failure analysis plans for new packages.
Analyze qualification data and support the transition of new packages into high-volume production.
Manage project schedules and deliverables and maintain design documents and reports in SharePoint.
Collaborate with cross-functional teams on new package development and optimization of existing high-volume production packages.
Work closely with internal and external package assembly sites to verify in-process data and oversee pre-production manufacturing execution.
Perform modeling and simulation using ANSYS and LS-DYNA for various semiconductor packages and processes.
Conduct mechanical and thermal material characterizations using an Instron mechanical tester and Siemens T3ster.
Create detailed technical reports and presentations for both technical and non-technical audiences.