Senior Packaging Engineer

Teledyne Technologies Incorporated•Milpitas, CA

1d•Onsite

About The Position

As a Senior Packaging Engineer at Teledyne HiRel Electronics, you’ll play a critical role in shaping the future of aerospace and defense electronics. You will lead packaging design initiatives, ensuring our products meet stringent reliability standards while driving innovation in integrated circuit packaging. Your expertise will help us deliver cutting-edge solutions to meet customer demands and industry trends.

Requirements

Strong knowledge of semiconductor electronics and IC packaging – required.
Master’s degree in engineering or equivalent experience (8+ years) – required.
Familiarity with packaging materials and high-reliability applications – required.
Ability to work independently and on-site – required.
US citizenship and valid passport – required.
Ability to travel up to 10% domestically and internationally – required.

Nice To Haves

Experience in aerospace and defense segment – preferred.
MIL-STD 883 and 1835 experience – preferred.

Responsibilities

Lead the design and development of new integrated circuit packages (plastic, ceramic, hybrid).
Translate customer requirements into optimized packaging solutions.
Collaborate with production and marketing teams to ensure feasibility and cost-effectiveness.
Assess and negotiate design trade-offs with customers and internal teams.
Research technology trends and recommend improvements for high-reliability applications.
Review and generate mechanical drawings for custom and standard packages.
Interface with customers and suppliers to represent Teledyne with authority and expertise.
Maintain knowledge of MIL-STD 883 and 1835 standards and apply them to designs.