Senior Engineer, Product Engineering (Mfg.)

Analog DevicesSan Jose, CA
2dHybrid

About The Position

About Analog Devices Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible™. Learn more at www.analog.com and on LinkedIn and Twitter (X) . Employer: Analog Devices, Inc. Job Title: Senior Engineer, Product Engineering (Mfg.) Job Requisition: R252068 Job Location: San Jose, California Job Type: Full Time Rate of Pay: $134,679.00 - $158,865.00/year Duties: Manage new product introduction and production support engineering for a specific product or group of products after transfer from design to in-house or outsourced production. Interface with design, process, test, reliability, and manufacturing engineering to solve product issues and production problems. Develop and sustain process improvements to reduce production costs and increase yields. Perform Yield Enhancement root cause analysis and Failure Analysis on a variety of analog and mixed signal integrated circuits. Define problems by identifying failure modes, quantity of material affected, percent fallout, etc. Perform data analysis, problem characterization, fault isolation, and physical failure analysis to determine the root cause of the problem. Support product reliability qualification testing and analysis, and package qualification testing and analysis. Conduct low yield failure analysis for process transfer and product transfer between fabrications. Partial telecommute benefit (2 days WFH).

Requirements

  • Must have a Master's degree in Electrical Engineering, Materials Engineering, Physics or related field of study (or foreign education equivalent) and two (2) years of experience as a product engineer or related occupation performing solid circuit debugging and physical failure analysis.
  • Demonstrated Experience (DE) performing mixed integrated circuit (IC) and sensor modeling and simulation using Candance, Console, and Advanced Design System (ADS);
  • DE monitoring manufacturing process (Work in Process "WIP"), gathering test and process data for analysis to identify the failure models and potential root causes through shop floor control and yield management system such as ACE, or Excensio;
  • DE synthesizing ECAD, product datasheets and process design rules for new products and existing products; verifying schematics and layouts to determine electrical properties, and set up the test bench per customer document or failure analysis requirement; and
  • DE conducting physical non-destructive and destructive analysis using X-Ray, mechanical and chemical de-processing, mechanical cross-sectioning (such as Buehler, RIE, or Elite) on microelectronics or mixed IC, metallographic analysis, Scanning Electron Microscope "SEM", and element analysis (such as Energy Dispersive X-ray "EDX" or FIB).

Responsibilities

  • Manage new product introduction and production support engineering for a specific product or group of products after transfer from design to in-house or outsourced production.
  • Interface with design, process, test, reliability, and manufacturing engineering to solve product issues and production problems.
  • Develop and sustain process improvements to reduce production costs and increase yields.
  • Perform Yield Enhancement root cause analysis and Failure Analysis on a variety of analog and mixed signal integrated circuits.
  • Define problems by identifying failure modes, quantity of material affected, percent fallout, etc.
  • Perform data analysis, problem characterization, fault isolation, and physical failure analysis to determine the root cause of the problem.
  • Support product reliability qualification testing and analysis, and package qualification testing and analysis.
  • Conduct low yield failure analysis for process transfer and product transfer between fabrications.

Benefits

  • This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
  • This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time , and other benefits.
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