Senior Director, Systems Technology Development

Qualcomm•San Diego, CA

1d•Onsite

About The Position

We are seeking a Senior Director of Systems Technology Development to provide technical and execution leadership across our semiconductor technology portfolio. This role is designed for a highly experienced industry leader with deep hands‑on expertise in semiconductor technology development and a proven ability to deliver advanced silicon solutions into high‑volume products. The ideal candidate brings strong execution focus across process, chiplets, heterogeneous integration including memory, and interconnect technologies, with the ability to evaluate and drive power, performance, area, and cost (PPAC) tradeoffs. This role will guide technology decisions that enable differentiated products across mobile, IoT, data center, automotive, and XR business units, particularly as the industry moves beyond traditional Moore’s Law scaling. Position requires to be onsite in San Diego, 5 days a week

Requirements

20+ years of experience in semiconductor technology development, process integration, or advanced silicon platforms.
Deep expertise in logic process technologies, memory integration, interconnect, and chiplet heterogeneous integration.
Strong track record of executing complex technologies into production.
Demonstrated experience making and defending PPAC tradeoff decisions.
Proven ability to lead and influence large, cross‑functional engineering teams.
Experience working directly with foundries, and other semiconductor suppliers.
Bachelor's degree in Science, Engineering, or related field and 10+ years of ASIC design, verification, validation, integration, or related work experience.
Master's degree in Science, Engineering, or related field and 9+ years of ASIC design, verification, validation, integration, or related work experience.
PhD in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience.

Nice To Haves

Industry recognition as a senior technical leader in semiconductor technology execution or integration.
Experience supporting multiple market segments (mobile, IoT, data center, automotive, XR).
Background in 2.5D/3D, chiplets, heterogeneous integration.
Strong understanding of manufacturing constraints, yield learning, and cost scaling.

Responsibilities

Lead the execution of advanced semiconductor technologies from concept through manufacturing readiness.
Drive technology integration across logic, memory, interconnect, and chiplets with a focus on robust, manufacturable solutions.
Translate high‑level product and architectural requirements into clear technology requirements and implementation plans.
Own and influence PPAC tradeoff decisions across process nodes, design choices, and chiplet approaches.
Evaluate competing technology options to balance performance targets, power efficiency, die area, yield, and cost.
Guide teams in making data‑driven decisions that optimize end‑product KPIs while maintaining schedule and risk discipline.
Interface closely with silicon design, process integration, packaging, product engineering, and manufacturing teams.
Collaborate with internal domain experts to ensure cohesive execution across technology boundaries.
Provide technical leadership and mentorship to senior engineers and technology leads across the organization.
Influence medium‑ and long‑term technology roadmaps aligned with business and product needs.
Help evolve the organization from a transistor‑scaling‑centric mindset toward technology and integration‑driven differentiation, including advanced packaging and heterogeneous integration.
Engage with foundries, and key technology suppliers to assess readiness, risk, and scalability of emerging technologies.
Clearly communicate technology risks, tradeoffs, and execution plans to executive stakeholders.
Serve as a trusted technical advisor to leadership on technology investment decisions.
Represent the company in senior‑level discussions with external partners and ecosystem leaders.