Senior Analog Design Engineer
About The Position
At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. The ROLE: The Packaging Signal Integrity engineering team ensures that the performance requirements of the silicon and the cost requirements of the product are met through the integration of silicon, package and platform electrical design. Packaging Signal Integrity also provides design support to engineering design teams for both current and forward-looking product development and feasibility studies. The PERSON: The ideal candidate has the ability to effectively communicate ideas and results. Additionally, the candiate will collaborate and work both independently and harmoniously with others.
Requirements
- Experience with PCB, Package and IC level power delivery networks
- Experience in silicon packaging and PCB design for signal and power integrity
- Experience with high-speed digital signaling interfaces such as PCIE, GDDR6, HBM, HDMI
- Expertise in electrical modeling EDA and AMS tools such as HFSS, SIwave, HSPICE
- Expertise in electromagnetic theory and circuit analysis
- Experience with programming in Python or Matlab
Nice To Haves
- Prefer chiplet/MCM packaging knowledge
- MS or Ph.D. preferred
Responsibilities
- Responsible for early exploration and development of advanced chiplet architectures including novel packaging solutions and custom silicon.
- You will work on emerging I/O standards development and ensure product manufacturability based on current and forward-looking technology roadmaps.
- Active engagement required with multiple disciplines: circuit design, mechanical, thermal, and product engineering to solve multi-physics problems.
Benefits
- AMD benefits at a glance.
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
What This Job Offers
Job Type
Full-time
Career Level
Mid Level
