Semiconductor Research Engineer

Intel CorporationChandler, AZ
1dOnsite

About The Position

The Experimental Mechanics Lab identifies and solves thermo-mechanical issues in the development of next-generation electronic packaging technology. Lab personnel use a variety of tools to study the behavior of an electronic package and its constituents under different thermo-mechanical boundary conditions, like: dynamic warpage of package using optics-based tools; adhesion strength characterization of various interfaces in a package using Double Cantilever Beam test; fracture toughness measurement of bulk materials using three-point bend test; and CTE measurement using 3D Digital Image Correlation method. A typical job would involve design of experiment, setup definition including fixture fabrication, sample preparation, data collection and analysis, report presentation, and documentation. Lab engineers also help develop new metrologies to close gaps in lab capabilities when it comes to new packaging technologies. We are looking for a candidate with a strong background in Experimental Mechanics and they should also possess good problem solving skills and ability to multitask. An ideal candidate would have hands-on lab experience, work well in a team, and have experience with LabView.

Requirements

  • PhD degree in mechanical engineering, chemical engineering, materials science or a related field

Nice To Haves

  • Experience in mechanical testing and material characterization
  • Hands-on experience with test equipment such as: Load frames, Shadow Moire, nanoindenter, strain gages, digital image correlation, interferometers, DAQs, acoustic emission sensor, accelerometers, etc.
  • Experience in LabView and MATLAB programming

Benefits

  • We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
  • Find out more about the benefits of working at Intel.
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