Semiconductor Package Design Engineer

Micross•Apopka, FL

About The Position

Essential Duties and Responsibilities: The primarily responsible for design of advanced semiconductor packages, including both ceramic and organic substrates, including layout, parasitic extraction, and optimization Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposer and substrates Work with SoC design teams to optimize die floorplan, bump patterns and interposer / substrate stack up Work with IC design team to define IC package requirements Design package layout using standard CAD tools Extract package parasitics and conduct PI/SI analysis Documentation and release in appropriate archival system

Requirements

Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline.
8 to 10 years of experience in semiconductor packaging design, modeling, and simulations
Strong authority on Cadence Allegro Package Designer Plus (APD+)
Experience on interposer and substrate layouts and design in advanced package technologies
Experience with 2.5D, 3D package design
Experience with design teams on floor plan, bump and layout optimization
Excellent skills in problem solving, written and verbal communication, excellent organization skills, and highly self-motivated
Record of success in cross-functional team environment
Good experience with SI/PI tools for package level extraction/simulation

Nice To Haves

Layout: Allegro Package Designer Plus (APD+) tools for designing the package and generating artwork for fabrication.
Analysis: Celsius PowerDC (IR Drop)
Sigrity Advanced SI II: Analysis tools for Signal integrity of parallel busses ( DDRx) and serial links (PCIe Gen x), including Package and PCB effects
Sigrity Advanced PI II: Power Integrity tools ( IR drop, Impedance Profile, capacitor optimization) including Package and PCB effects
RF / Microwave Design AWR, Momentum and HFSS Software
Circuit, system, and EM simulation for RF/microwave product development

Responsibilities

Design of advanced semiconductor packages, including both ceramic and organic substrates, including layout, parasitic extraction, and optimization
Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposer and substrates
Work with SoC design teams to optimize die floorplan, bump patterns and interposer / substrate stack up
Work with IC design team to define IC package requirements
Design package layout using standard CAD tools
Extract package parasitics and conduct PI/SI analysis
Documentation and release in appropriate archival system