TTM Technologies, Inc. is a leading global manufacturer of technology solutions including engineered systems, radio frequency (“RF”) components and RF microwave/microelectronic assemblies, and quick-turn and technologically advanced printed circuit boards (“PCBs”). TTM stands for time-to-market, representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market. The Sales Application Engineer is responsible for Rigid & Rigid-Flex technology on emerging designs by providing field application engineering support to customers on PCB design rules, manufacturing technologies, and assembly. This position will interface with PCB & packaging design engineers in the early stages of the design process and provide feedback on routing and pad layout techniques, trade-off analysis of PCB layer stack-up, layer counts, signal integrity, material selection, surface finish, electrical and mechanical requirements based on clear understanding of the customer’s end product requirements (wireless technology platforms, reference designs, high reliability for aerospace & defense, ATE market, high speed computing, graphic video cards, backplanes and connector boards) while providing a cost effective solution to customers and designers for quick turn proto type PCB fabrication and applicability to high volume manufacturing.
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees