Remote Senior Electro-Mechanical Engineer

RTX•Washington, DC

20h•Remote

About The Position

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world. Raytheon Space & Airborne Mechanical Systems is currently seeking a Senior Electro-Mechanical Engineer for the Advanced Microelectronics Packaging and Design organization in El Segundo, CA to develop leading-edge miniaturized 3DHI sensors and systems to enable future generation technologies across Raytheon. This position offers the opportunity for remote work. What You Will Do: Work with cross-functional hardware engineering teams to develop advanced microelectronics packages including 3DHI, 3D, and 2.5D (interposer + chiplets) and novel material and process solutions for RF, digital, mixed-signal, and photonics products. Be involved in research efforts including initial concepts, advanced technology demonstrations, and will have the opportunity to follow product development from beginning to end, including documentation, fabrication, assembly, and test/delivery of a range of microelectronics products. Follow established procedures in creation of technical data package work products, while working closely with program management and functional supervision to ensure the overall design objectives are met. Ability to work independently and in a team environment, including as a leader of small teams semiconductor manufacturing processes and materials.

Requirements

Typically requires a Bachelor’s in Science, Technology, Engineering, or Mathematics (STEM) degree or a minimum of 5 years’ prior relevant experience, to include any combination of the following:
Experience in circuit layout design using 2D CAD tools
Experience performing mechanical and electrical engineering design
Experience with semiconductor manufacturing processes and materials
Experience with high density microelectronic packaging designs including Interposers, organic substrates, wafer and chip bumping
Experience with electronic components / devices such as ASICs and FPGAs
Experience with the design of electronic packaging chassis and structures, interconnects (connectors/cables), and / or thermal management design of high-density electronic systems and electronic enclosures

Nice To Haves

RF circuit design, including 3D EM simulation in HFSS or similar tools
Circuit layout design experience using 2D and 3D CAD tools (Cadence Virtuoso and/or Allegro/APD+)
Experience and familiarity with selection and oversight for semiconductor wafer processing and finishing (plating, bumping, dicing)
Design experience with 3D and 2.5D packaging, complex CAD/EDA software design workflows, and RF/Thermal/Digital co-design
Experience qualifying and implementing cutting edge materials, fabrication techniques, and understanding of relevant materials used in semiconductor manufacturing and packaging
Strong background in development, documentation, fabrication, assembly, and test/delivery of military/defense and/or commercial state-of-the-art electronic products
Experience with designing electronics for extreme environmental requirements and design constraints
Proficiency with 3D Mechanical CAD modeling and analysis tools (e.g., Solidworks, Creo).
Experience in Geometric Dimensioning and Tolerance analysis for drawings
Possess an active security clearance

Responsibilities

Work with cross-functional hardware engineering teams to develop advanced microelectronics packages including 3DHI, 3D, and 2.5D (interposer + chiplets) and novel material and process solutions for RF, digital, mixed-signal, and photonics products.
Be involved in research efforts including initial concepts, advanced technology demonstrations, and will have the opportunity to follow product development from beginning to end, including documentation, fabrication, assembly, and test/delivery of a range of microelectronics products.
Follow established procedures in creation of technical data package work products, while working closely with program management and functional supervision to ensure the overall design objectives are met.
Ability to work independently and in a team environment, including as a leader of small teams semiconductor manufacturing processes and materials.