R&D Hardware Mechanical Design Engineer Summer Intern
About The Position
Keysight is on the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do. Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers. As an R&D Mechanical Engineer Intern you will be part of Keysight Lab’s mm-Wave subsystems design group in Santa Rosa, CA which is currently developing leading-edge mm-wave front-end products that address a variety of market applications (5G, 6G, Automotive Radar, Aero/Defense). As part of this group, you will have the opportunity to apply your mechanical engineering skills to all phases of the design process including simulating and analyzing proposed designs (thermal, stress and electro-mechanical), documenting new designs and assemblies, and investigating forward-looking electronics packaging technologies.
Requirements
- Working towards a degree in Mechanical Engineering or related field at an accredited university
- Experience with 3D CAD (preferably Siemens NX)
- Experience/interest with mechanical thermal and stress FEA analysis tools
- A self-starter with the ability to generate new ideas, navigate a dynamic environment and deliver results
- Strong foundation of engineering fundamentals
- Excellent written and verbal skills and ability to work across multiple disciplines
- Candidates who wish to be considered must be enrolled in a accredited college/university as of September 2026. Applicants who have graduated before September 2026 will not be considered unless they are entering/applying to a MS or PHD program after graduating.
- Visa Sponsorship is not available for this position. Candidates who now or at any point in the future require sponsorship for employment visa status (e.g., H-1B Visa status) may not be considered.
Nice To Haves
- A strong interest in the mechanical design of electronics packaging and interconnect
- An understanding of various mechanical fabrication processes (machining, die casting, plastic molding, sheet metal) and engineering materials.
Responsibilities
- Develop thermal and mechanical models to solve challenging electronics packaging issues.
- Work within a multi-discipline project team to investigate and evaluate new electronics packaging technologies.
- Document new designs and assemblies
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What This Job Offers
Career Level
Intern
Education Level
No Education Listed
Number of Employees
5,001-10,000 employees
