Production Specialist (Wire Bond) | 2nd Shift

Microchip Technology Inc.•Mount Holly Springs, PA

23h•$17 - $27•Onsite

About The Position

Microchip Technology Inc. is a market leader in designing, manufacturing, and marketing Frequency Control, Sensor, and Hybrid Product solutions using the latest cutting-edge techniques. For over 70 years, our facility has provided solutions for Satellite Constellations, Deep Space Exploration Missions, Military Systems, GPS, Communication Networks, and much more. Our Production Specialist (Wire Bond) employees are machine operators who perform wire bonding operations in the production of our crystal oscillators. You may be a good fit if you have hobbies related to sewing, crocheting, cross-stitching, and related activities! Just as sewing requires precision in stitching fabric together, a wire bonder requires the same careful attention to detail when making bonds. If you have a desire to learn, strong hand eye dexterity, and a quality mindset, this could be a great position for you! Experience is preferred but not necessary as on the job training is provided!

Requirements

Ability to multi-task while paying careful attention to detail
Prior success working both individually and in a team environment
Good written and verbal communication skills
Ability to follow written and verbal direction
Ability to read, comprehend and follow detailed work specifications
Excellent listening skills
Adaptability to frequent change and improvements
Regular and predictable attendance is essential
Ability to wear the required Protective Equipment
Basic computer, math and reading comprehension skills
You must be 18 years old with a high school diploma or GED

Nice To Haves

Technical certification or associates degree in electronics or related field.
Previous manufacturing experience.
Proficiency with wire bonding machines and related tools/materials.
Knowledge of semiconductor and crystal oscillator assembly processes.
Six Sigma or Lean Manufacturing knowledge

Responsibilities

Wire Bonding Operations: perform fine wire bonding using various bonding techniques (e.g., thermosonic and hypersonic) on crystal oscillator components, ensuring proper placement and electrical connectivity.
Equipment Operation: Set up, calibrate, and operate wire bonding machines (e.g., wedge bonder, ball bonder) to meet production requirements and specifications.
Quality Control: Inspect completed wire bonds for quality assurance, ensuring compliance with internal and industry standards. Identify and troubleshoot defects such as voids, misalignments, and non-conformances.
Process Optimization: Monitor wire bonding processes to identify opportunities for improving efficiency, yield, and reliability. Recommend and implement process improvements.
Documentation: Maintain accurate records of production runs, wire bonding parameters, and inspection results.
Collaboration: Work closely with engineering and production teams to troubleshoot issues, implement process changes, and ensure production schedules are met.
Safety and Compliance: Adhere to all safety protocols and company policies. Ensure that work is carried out in a clean, safe, and organized environment.