Product Marketing Manager 3

Onto Innovation•Wilmington, MA

2d•$77,840 - $116,760

About The Position

You will lead product marketing for Onto Innovation’s 3Di™ and IR inspection solutions within the semiconductor process control space and be the voice of these flagship technologies. You’ll create compelling positioning and go-to-market programs that underscore Onto’s technical advantage and business impact for advanced packaging, HBM, hybrid bonding, logic, and memory fabs. Onto’s 3Di and IR inspection platforms—integrated into Onto’s Dragonfly® platform are reshaping process control in 3D packaging and hybrid bonding. These tools enable manufacturers to achieve unmatched precision in bump height control and detect sub-micron voids non-invasively. Your role ensures these innovations reach the right audiences with the right message, driving adoption cycles and elevating Onto’s market leadership across inspection and metrology segments.

Requirements

Minimum 5 years in semiconductor process control or advanced packaging inspection/metrology, especially with expertise in 3D bump measurement or hybrid bonding.
Hands-on/marketing experience in laser triangulation, IR imaging, or metrology embedded in high-speed fab tools.
Familiarity with Onto Innovation’s Dragonfly inspection platform, IR imaging, and associated software platforms (e.g., TrueADC, Discover®, Discover® AI/Defect) is preferred.
Ability to translate system-level capabilities into fab-level business outcomes (yield, throughput, cost of ownership).
Proven success in developing product launch strategies, technical collateral, and enabling global field sales for complex semiconductor equipment.
Excellent communicator with demonstrated proficiency in live demos, webinars, case study management, and conference presentations.
Strong command of market-sizing, competitive intelligence, and customer profiling.
Aptitude for synthesizing technical specs into compelling product narratives and differentiators.
Effective collaborator across functions such as Sales, R&D, Ops, and Customer Success.
Goal and timeline focused—able to drive alignment, prioritize initiatives, and deliver high-impact results on schedule.

Responsibilities

Map the competitive landscape and the positioning of 3Di and IR inspection systems across the entire semiconductor inspection and metrology markets.
Quantify ROI for these technologies and tying into yield improvement for HBM, GPU, and hybrid-bonded logic/memory fabs.
Develop differentiation strategies to highlight the unique features of 3Di’s for precision bump metrology and IR inspection for sub-micron embedded defect detection capability on Dragonfly® platform.
Craft sector-specific messaging for advanced packaging, wafer bumping, and hybrid bonding applications.
Support launches of the technologies through webinars, technical briefs, sales training, and targeted campaigns.
Enable field teams to articulate how precise bump metrology and sub-surface defect inspection adds yield trends and defect mapping value across various advanced packaging processes.
Develop data-driven toolkits showcasing bump-height profile reproducibility and void detection sensitivity.
Equip global sales with ROI-based calculators and use case playbooks
Spearhead participation at SEMICON and Fab-focused panels where these technologies offer demonstrable competitive advantage.
Align closely with R&D & product management to feed market insights into future product development.
Partner with marketing communications team to deliver thought leadership—e.g., application notes, data-driven proof-of-concept content.