Process Technician

Viasat, Inc. • Tempe, AZ

10d • $36 - $56

About The Position

You will provide critical technical support for advanced microelectronics assembly, focusing on SMT, wire bonding, and AirVac hot air rework operations. Your primary responsibility is to ensure production equipment operates at peak performance through meticulous setup, calibration, and real-time solving. You'll ensure precise component removal and replacement without compromising board integrity.

For SMT activities, you will monitor stencil printing and pick-and-place accuracy, making necessary adjustments to maintain high-yield standards.
In the wire bonding arena, you will fine-tune ultrasonic parameters and loop profiles for both gold and aluminum applications, performing destructive and non-destructive pull testing to validate bond strength. Beyond hardware maintenance, you will collaborate with process engineers to document standard operating procedures and implement continuous improvement initiatives to reduce scrap. You must be comfortable working under a microscope, interpreting complex engineering drawings, and utilizing precision metrology tools.
The daily routine for this role begins with a comprehensive equipment readiness check, ensuring that AirVac systems, wire bonders, and SMT lines are calibrated and thermally stabilized for the shift’s specific production requirements. You will spend a significant portion of your morning performing intricate setup procedures, such as configuring nozzle heights for hot air rework or adjusting capillary parameters for fine-pitch wire bonding. As production flows, you will act as the first line of defense for any technical deviations, stepping in to troubleshoot machine errors or refine thermal profiles on the fly to prevent defects.

Requirements

• 3+ years' experience in electronics assembly
• Experience performing manual soldering and assembly of electronic devices
• IPC-610 and J-STD, 620 certified soldering skills
• Proven ability to interpret complex assembly drawings
• Experience working in an engineering prototype environment
• Demonstrated experience with wire bonding
• Experience using Oracle, Solumina, Agile and Microsoft office
• Excellent mechanical assembly skills
• Must be able to read and following drawings
• Ability to work on assemblies while looking through a microscope for 8+ hours per day
• High school diploma or GED or equivalent experience
• US Government Position. US Citizenship Required

Nice To Haves

• Experience with military and space assembly is desirable
• Experience building cables and harnesses is desirable
• Experience mixing and applying epoxies, adhesives, and other types of materials

Responsibilities

• Provide critical technical support for advanced microelectronics assembly, focusing on SMT, wire bonding, and AirVac hot air rework operations
• Ensure production equipment operates at peak performance through meticulous setup, calibration, and real-time solving
• Ensure precise component removal and replacement without compromising board integrity
• Monitor stencil printing and pick-and-place accuracy, making necessary adjustments to maintain high-yield standards
• Fine-tune ultrasonic parameters and loop profiles for both gold and aluminum applications, performing destructive and non-destructive pull testing to validate bond strength
• Collaborate with process engineers to document standard operating procedures and implement continuous improvement initiatives to reduce scrap
• Perform intricate setup procedures, such as configuring nozzle heights for hot air rework or adjusting capillary parameters for fine-pitch wire bonding
• Troubleshoot machine errors or refine thermal profiles on the fly to prevent defects

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: High school or GED
• Number of Employees: 1,001-5,000 employees