Process Integration Lead, APTD

Micron Technology•Boise, ID

About The Position

As a Process Integration Lead in the Advanced Packaging Technology Development [APTD] team, your responsibilities will include but are not limited to leading a team of experienced engineers in the development of advanced wafer level and die level interconnect technologies. Successful technology development includes ensuring that targeted products meet performance, cost, manufacturability, quality, reliability and schedule requirements. Also, you will have responsibility to work with peers and internal partners across organizations to coordinate the transfer of new integration flows to High Volume Manufacturing [HVM] sites. You will be recognized as an authority in broader integration areas by peers in the manufacturing and technology development organizations. The ideal team member would be adept to accepting change and volatility and operate with a sense of urgency. Apply sound engineering principles and judgment, seek advice from authorities, and make critical and timely decisions. You will need to advise and lead the work of others and ensure good communication, engagement, and accountability leading to the achievement of the program goals.

Requirements

15+ years of professional experience in the semiconductor industry.
MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or a closely related field, or equivalent professional experience demonstrating senior‑level technical capability.
Professional experience in process integration, process development, advanced packaging, or closely related semiconductor technology domains within an R&D environment (IDM, foundry, OSAT, or equivalent).

Nice To Haves

End‑to‑end ownership of integration solutions, including technology definition, process development, qualification, and successful transfer to high‑volume manufacturing.
Deep, practical expertise in advanced packaging and interconnect technologies, such as:
2.5D and 3DIC integration
Wafer‑level and fan‑out packaging
Wirebond, microbump, and/or hybrid bonding
Experience should reflect direct technical ownership, not oversight alone.
Strong semiconductor technology background, with experience in memory (DRAM, NAND) and/or logic
Demonstrated strength in process integration problem‑solving, including:
Design of Experiments (DoE) and data-driven decision making
Root‑cause analysis and decision‑making methodologies (e.g., KT or equivalent)
Ability to operate optimally in fast-paced, ambiguous R&D environments

Responsibilities

Drive process innovation for outstanding solutions and technology
Vertical integration capability to define highly sophisticated process flows
Develop, innovate and establish contingency plans
Define and Implement Design of Experiment (DoE)
Perform Kempner-Tregoe (KT) or KT-like problem-solving & decision-making process
Passionate about cost efficiency
Communications - same site, site-to-site and Executive leadership
Coaching & mentoring
Coaching & mentoring early/mid-career engineers & technicians
Teaching classes as needed
Growth mindset
Continue to build new skills through development goals & learning events
Seek out opportunities to work multi-functionally, build a network, & gain competency across domains

Benefits

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
Additionally, Micron benefits include a robust paid time-off program and paid holidays.
For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

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