Process Integration Engineer

Applied Materials•Albany, NY

7d•$176,000 - $242,000

About The Position

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits . The successful candidate will be in Santa Clara, CA or Albany NY as a member of a global diverse cross functional team responsible for developing new modules in Advanced Semiconductor Packaging.

Requirements

Minimum of BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent
10 years of experience in semiconductor packaging development and manufacturing
Strong communication skills to be effective in dealing with Business Units, cross-functional teams, internal or external manufacturing and customer
Lead project across organization and culture in a fast-paced environment
Self-starter, team player and able to work independently with minimal supervision
Business Expertise Applies broad industry and commercial awareness to drive financial and operational performance across business unit, department or sub-functions
Leadership Leads through influence, knowledge and connections; Operates with managers from both within and outside the immediate business unit she/he will be a part of; executes segment/functional business plans and contributes to the development of segment/functional strategy
Problem Solving Directs the resolution of highly complex or unusual business problems applying advanced analytical thought and judgment
Impact Guided by segment/functional strategy, impacts results of a department, business unit or sub-function or facilitates the work done by other segments/functions by providing support to impact the business
Interpersonal Skills Negotiates and influences the opinions of others at the senior executive level and in external organizations; exercises sensitivity to the audience
Position requires understanding of Applied Materials global Standards of Business Conduct and compliance with these standards at all times. This includes demonstrating the highest level of ethical conduct reflecting Applied Materials' core values.

Responsibilities

Developing new modules leveraging Applied’s wide equipment portfolio and help advice the packaging Business Unit on equipment requirements for Advanced semiconductor packaging.
File for IP on new patentable developments
Domain expertise in advanced packaging areas such as W2W / D2W bonding, micro bumps, TSV, thermal management, optics and multi-wafer stacking with deep understanding of materials, process, device physics and integration.
Ability to drive new materials and process development to enable new inflections in logic, DRAM and NAND through structured problem-solving methodology.
Proven track record of solving complex problems through innovation and ideation of novel approaches.
Act as engineering expert in semiconductor packaging and help drive cross functional projects by working with engineers, managers and directors/Senior directors across Applied’s business units, including the packaging business unit.
Help structure and maintain Applied’s roadmap in Packaging modules and how it fits within advanced modules with the industry.
Help design experiments to help improve packaging wiring to improve performance, by reducing RC delays and increasing wiring density in various dielectrics, including polymer dielectrics and deposited thin film dielectrics.
Represent Integration Module Solutions (IMS) as a module specialist to various business units within Applied and to customers, outside Applied.
Define engineering plans, design DOEs, help characterize and create engineering reports for advanced packaging.
Create roadmap committees for some packaging applications and help shepherd Applied’s product portfolio.