Process Integration Engineer

Micron Technology • Boise, ID

3d

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join our dynamic Process Integration team and contribute to the development and optimization of advanced semiconductor processes in a green field FAB environment. This experienced-level role offers hands-on experience in yield improvement, cost reduction, and technology transfer for next-generation devices. You will work in a fast-paced environment, collaborating with cross-functional teams to ensure best-in-class quality and performance. As a Process Integration Engineer (PIE) for our Advanced Technology and Engineering team, you will learn to work very closely with global teams to drive process integration across multiple different groups. This position will be working with the PIE team to transfer and introduce the DRAM node from Technology Development (TD) or other HVM fab to our new state of the art manufacturing facility at the Boise fab including yield ramp, cost reduction and quality improvement to production level. You will cooperate and coordinate with central team, other fabs, TD, quality team, design team to implement the best in class known methods and BKM to Boise Expansion (ID1).

Requirements

• Bachelor's degree with 3+ years of HVM or FAB experience
• 3+ years of experience working with Memory Technology
• 2+ years of experience in semiconductor fabrication areas such as yield ramp, reduction of cost, and quality improvement.
• Clear understanding of transistor operations, scaling limitations and reliability
• Basic knowledge of CMOS and characterization methods

Nice To Haves

• Master's or Ph.D. degree in Material science, Electrical, Electronics, Chemical or Engineering areas
• Experience with TD, Process Integration, Device, Yield analysis, QR
• Experience working with 300mm semiconductor environment.
• Proven knowledge of tech transfer and development

Responsibilities

• Act as a module owner to conduct root cause investigations and failure analysis in time-sensitive environments.
• Drive improvements in yield, cost efficiency, and quality.
• Run Design of Experiments (DOE) to enhance process capability and margin.
• Address top detractors to improve device yield and reliability.
• Lead workshops during technology transfer for next-generation devices.
• Start up, develop, and optimize processes for product quality and reliability.
• Identify and resolve process-related issues using FMEA, 8D, SPC/FDC methodologies.
• Coordinate and manage process, equipment, and material evaluations.
• Validate and qualify new processes, tools, and materials for new product introduction.
• Manage and audit material suppliers to meet quality, cost, and risk objectives.
• Be prepared to work a shifted schedule as the need arises.

Benefits

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees