Process engineer

Applied Materials • Santa Clara, CA

2d • Onsite

About The Position

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze data, perform hardware characterization, and troubleshoot engineering issues. You'll also measure film properties, generate technical documentation, and engage with customers to resolve concerns. Process Engineers collaborate with vendors and suppliers, and become familiar with implementing new technologies and products. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects. We are seeking a highly skilled Process Engineer with deep experience in photonics and advanced packaging technologies to support the development of high-performance photonic interconnects and co-packaged optical systems. This role is critical for enabling high-density, low-loss interconnects in next-generation computing, sensing, and communication platforms.

Requirements

• Ph.D. in EE, MSE, Phys, or related discipline (M.S. with relevant experience may be considered).
• Proven experience in Cu RDL layout, design, fabrication, and integration.
• Hands-on expertise in thermal compression bonding and hybrid bonding processes.
• Experience with Co-Packaged Optics (CPO) and Optical Engine development.
• Experience working in cleanroom environments and advanced IC fabrication.
• Proficiency in design layout and simulation software such as Cadence (APD/SIP), AutoCAD, SolidWorks, KLayout, COMSOL and Ansys.
• Strong problem-solving skills and ability to work in a collaborative research environment.

Responsibilities

• Design and develop advanced packaging architectures for microLED photonic interconnects and heterogeneous integration.
• Lead Cu backplane RDL design, layout, fabrication, and integration.
• Develop mass transfer and die bonding solutions, including thermal compression bonding and hybrid bonding, tailored to system integration requirements.
• Collaborate with substrate layout, IC design, and module teams to co-optimize packaging, signal integrity, and thermal performance.
• Perform thermal, mechanical, and optical simulations to validate packaging reliability and performance.
• Conduct optical, electrical, and tolerance analysis of photonic devices; optimize components for performance, efficiency, reliability, and manufacturability.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: Ph.D. or professional degree
• Number of Employees: 5,001-10,000 employees