Process Engineer, Senior

MACOM Technology Solutions Holdings, Inc.

9d•$98,000 - $130,000

About The Position

In this critical role, you will be responsible for the Grind/Polish and wafer bonding processes within MACOM’s internal wafer fab. You will also assist in other areas as needed and provide backup coverage for additional operations within the upstairs fab. This role includes both developing new fab processes and sustaining existing ones. The product portfolio includes GaN, GaAs, Si, and InP-based technologies.

Requirements

Excellent judgment, familiarity with semiconductor processing, and an optimistic, proactive approach.
Ability to develop solutions using formal education, statistical methods, and structured problem-solving tools.
Proven track record of solving technical problems, owning projects, meeting deadlines, and managing multiple tasks.
Strong sense of ownership, enthusiasm, and dedication to process improvement.
Ability to work collaboratively with cross-functional teams to enhance processes.
Excellent verbal and written communication skills, including technical writing for data summaries, findings, process specifications, equipment documentation, and work instructions.
Knowledge of optical component fabrication and polishing.
Knowledge of wafer polishing, Wafer Grinding, Edge Grinding, and CMP processes.
Hands-on experience in wafer fabrication processes.
Basic project management experience and ability to work with minimal supervision.
Strong presentation skills and ability to communicate effectively with all levels of management and across diverse departments.
BS in Engineering. Minimum 5 years of relevant work experience in semiconductors / Wafer fabrication process.
Familiarity with typical material systems used in compound semiconductors and a solid understanding of device physics and IC processing.
Demonstrated knowledge of compound semiconductor processing in a wafer fabrication environment or similar setting.
Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

Nice To Haves

Experience with data mining, statistics, SPC, DOE, Lean manufacturing, Six Sigma, and structured problem-solving methodologies is preferred.

Responsibilities

Develop, continuously improve, and sustain processes in close partnership with Device and Integration Engineering and Business Unit design teams.
Serve in a hands-on capacity requiring a broad understanding of wafer fabrication equipment and processes. Responsibilities include setup, qualification, optimization, and troubleshooting of automated equipment used for Wafer Grinding, Edge Grinding, Chemical-Mechanical Planarization (CMP), Polishing, Wafer Bonding and Mount/Demount processes.
Sustain wafer fabrication processes to meet all factory indicators; plan and execute experiments to fully characterize processes throughout the development cycle; drive improvements in quality, reliability, cost, yield, process stability/capability, productivity, and safety/ergonomics across variables such as material, method, equipment, environment, and operating personnel.
Provide daily process support, including equipment setup, writing new programs, adjusting/optimizing parameters, running engineering lots, troubleshooting equipment, and supporting production in identifying, responding to, and dispositioning non-conforming material.
Take ownership of entire processes, including equipment selection, process and equipment qualification, writing detailed setup instructions and procedures, and training operators, technicians, and other engineers on equipment operation. Update and create routing documentation as needed.
Apply general knowledge of electronics manufacturing and maintain strong technical understanding of wafer fabrication processes.