As an Engineer I, the successful candidate will be responsible for design, development, modification, and analysis of semiconductor and packaging processes and products/devices. The role involves process troubleshooting as well as collaboration with other team members on new process development. The applicant shall have experience in several of the following areas: solvent clean and etch, plating, paints and coatings, adhesive selection, failure analysis, mechanical and optical dimensional measurements, interpreting mechanical and electrical drawings, and familiarity with motion controls and vision systems.
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Job Type
Full-time
Career Level
Entry Level