About The Position

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. MACOM has more than 75 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. In addition, MACOM offers foundry services that represent a key core competency within our business. MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio. Process Development Engineer-Senior - GaN TDI Process Engineer In this critical role you will be responsible for developing and sustaining process and device technology for MACOM's internal semiconductor fab. Responsibilities include development of new process technologies, continuous improvement of existing processes, and sustaining existing device process technologies all in close partnership with Business Unit device design teams and the Fab Process Engineering team. Expertise in compound semiconductor processing, device physics, and data analysis are essential to success in this role. This position reports to the RTP TDI process manager. The right candidate will: Possess a strong knowledge of GaN device physics. Be well versed in data extraction and data analysis tools such as JMP. Have a strong understanding of electrical test methodologies (DC, S-Parameters, Load Pull, etc.) Familiarity with scripting/coding languages (Python, C#, VB, etc.) Be able to thrive and succeed in a fast-paced, high intensity environment, and not be hindered by ambiguity or competing priorities. Remain industry informed, familiar with the latest technologies and industry trends. Enjoy finding solutions to difficult problems. Understand (TDI) test, dice and inspection processes for compound semiconductors

Requirements

  • Candidate will have a M.S. or PhD in Electrical Engineering, Materials Engineering, Physics, or similar with a minimum of 5 years of compound semiconductor processing experience.
  • Possess a strong knowledge of GaN device physics.
  • Be well versed in data extraction and data analysis tools such as JMP.
  • Have a strong understanding of electrical test methodologies (DC, S-Parameters, Load Pull, etc.)
  • Familiarity with scripting/coding languages (Python, C#, VB, etc.)
  • Be able to thrive and succeed in a fast-paced, high intensity environment, and not be hindered by ambiguity or competing priorities.
  • Remain industry informed, familiar with the latest technologies and industry trends.
  • Enjoy finding solutions to difficult problems.
  • Understand (TDI) test, dice and inspection processes for compound semiconductors
  • Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

Responsibilities

  • developing and sustaining process and device technology for MACOM's internal semiconductor fab
  • development of new process technologies
  • continuous improvement of existing processes
  • sustaining existing device process technologies all in close partnership with Business Unit device design teams and the Fab Process Engineering team

Benefits

  • Health, dental, and vision insurance.
  • Employer-sponsored 401(k) plan.
  • Paid time off.
  • Professional development opportunities.
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