MMIC Design Engineer

AttoTude•Menlo Park, CA

5d•Remote

About The Position

AttoTude is a leader in groundbreaking interconnect technology for AI and hyperscale data center applications. Our solution offers significant improvements in speed, power, reliability and cost compared to existing interconnect solutions. In addition, the solution supports high radix, high density architectures that are critical for AI and hyperscale data centers while leveraging existing manufacturing processes. The technology does not require any specialized assembly lines, simplifying its ability to scale to high-volume production. We are seeking a highly experienced THz IC Design Engineer to join our growing team. In this role, you will be the technical lead in the design and development of cutting-edge mixed-signal ICs. You will be involved in the technical aspects of the THz IC design and development, from concept through to production. This is a hands-on technical position that requires in-depth technical expertise, and the ability to work in a team of highly experienced engineers to accomplish the goals.

Requirements

10+ years of hands-on experience in III-V (GaAs, GaN and InP) IC design in Bipolar and HEMT process technologies.
Proven expertise in designing high-speed interconnects, voltage-controlled oscillators (VCOs), multi-phase clock generation, travelling wave amplifier (TWA), mixers (active and passive)
Strong background in analog functional blocks design, including ESD, matching networks
Strong communication, leadership, and project management skills
Master’s Degree (MEng) in Electrical Engineering or related field is required

Nice To Haves

A Ph.D. in Electrical Engineering, Computer Engineering or a related field is preferred
Experience with high speed device technologies.
Understanding tradeoff at the device level for high performance ASIC implementation
Ability to drive innovation and implement new design methodologies.
Experience working in fast-paced environments with a strong track record of delivering high-quality designs on time.

Responsibilities

Design and development of THz ICs for cutting edge AI and Cloud Computing systems
Ownership of the full design cycle, including architecture definition, block-level design, simulation, verification, layout and evaluation
Drive high-speed IC design, >100GHz bandwidth in Si, SiGe and III-V semiconductor technologies
Collaborate with cross-functional teams to ensure timely project execution and design tape-outs
Stay updated with the latest trends and technologies in wideband high speed IC design and apply them to improve project outcomes
Occasional travel to the Bay Area (<10%) for remote position