Printed MOx Sensor Fabrication Intern

Bosch GroupSunnyvale, CA
1d$31 - $64Onsite

About The Position

Bosch Research is seeking an intern to support development of printed metal-oxide (MOx) sensing materials for gas sensing. The intern will help establish a reliable fabrication workflow that combines piezo dispensing / inkjet printing with wire bonding and packaging practices suitable for small MEMS-based sensor substrates. In this role, you will: Operate and develop procedures for piezo or inkjet deposition of MOx inks on small substrates/MEMS chips. Assist in ink formulation optimization (solvent/binder/dispersant, solids loading, filtration, stability) in collaboration with UC Berkeley partners. Develop and document printing process parameters (patterning approach, drop spacing, passes, substrate mounting, drying/curing steps, inspection/QC). Perform and document wire bonding procedures for printed sensor substrates (process setup, parameter optimization, yield tracking, basic failure analysis). Support experimental logistics and coordination for occasional work at Stanford (SNF) and UC Berkeley (e.g., tool access, sample transport, on-site runs as needed). Maintain organized experimental records and deliver clear “runbooks” (SOP-style documentation) to improve repeatability. The internship emphasizes hands-on lab work, process development, and collaboration across academic and industry teams.

Requirements

  • Currently pursuing a BS, MS, or PhD in Chemical Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, Chemistry, or a related field.
  • Hands-on lab experience with at least one of the following: thin film/coatings, nanoparticle dispersions, microfabrication, printing/dispensing, or device assembly.
  • Strong attention to detail and good experimental hygiene (clean handling, contamination control, documentation).
  • Ability to work 100% onsite in Sunnyvale, CA for the duration of the internship.
  • Strong communication and teamwork skills; ability to work independently with guidance.
  • Minimum GPA of 3.0

Nice To Haves

  • Experience with inkjet / piezo dispensing / microarray spotting or other precision deposition tools.
  • Experience with nanoparticle ink formulation (dispersion stability, rheology, filtration, surfactants/binders).
  • Experience with wire bonding (ball or wedge bonding), die handling, or basic packaging/assembly.
  • Familiarity with surface wetting, contact angle, drying/coffee-ring effects, or basic microscopy/inspection methods.
  • Comfortable analyzing and plotting data in Python/Excel (nice to have)

Responsibilities

  • Operate and develop procedures for piezo or inkjet deposition of MOx inks on small substrates/MEMS chips.
  • Assist in ink formulation optimization (solvent/binder/dispersant, solids loading, filtration, stability) in collaboration with UC Berkeley partners.
  • Develop and document printing process parameters (patterning approach, drop spacing, passes, substrate mounting, drying/curing steps, inspection/QC).
  • Perform and document wire bonding procedures for printed sensor substrates (process setup, parameter optimization, yield tracking, basic failure analysis).
  • Support experimental logistics and coordination for occasional work at Stanford (SNF) and UC Berkeley (e.g., tool access, sample transport, on-site runs as needed).
  • Maintain organized experimental records and deliver clear “runbooks” (SOP-style documentation) to improve repeatability.
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