Principal SI/PI Design Engineer
About The Position
As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact. How You Will Contribute: As an SI/PI Design Engineer, you will be an integral part of the Ciena engineering team and lead the electrical package design for custom in-house photonic, analog, and digital ICs supporting next generation optical modules. Own and drive advanced package selection, new product BGA configuration and package structure Responsible for package/SIP layout, optimization, design verification and tapeout Interface and coordinate with cross-functional groups throughout Ciena on new product package selection, feasibility analysis and design Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out Simulate and optimize signal/power integrity and RF performance of the package design Interface and work with CMs and vendors for the sourcing existing designs and future product development
Requirements
- BS in Electrical Engineering or Physics
- 5+ years hands on experience with IC package design
Nice To Haves
- Substrate design experience for RF, digital, high speed and mixed signal die
- Thorough understanding of signal and power integrity fundamentals
- Proficient in Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD) tools (Cadence highly preferred)
- Fluent in SI/PI and EM simulation tools such as SIWave, HFSS
- Experience in package design electrical review, SI/PI analysis
- Experience in package design for manufacturing reviews
- Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers
- Problem solver with strong engineering fundamentals
Responsibilities
- Own and drive advanced package selection, new product BGA configuration and package structure
- Responsible for package/SIP layout, optimization, design verification and tapeout
- Interface and coordinate with cross-functional groups throughout Ciena on new product package selection, feasibility analysis and design
- Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out
- Simulate and optimize signal/power integrity and RF performance of the package design
- Interface and work with CMs and vendors for the sourcing existing designs and future product development
Benefits
- medical, dental, and vision plans
- participation in 401(K) (USA) & DCPP (Canada) with company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- company-paid holidays
- paid sick leave
- vacation time
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
What This Job Offers
Job Type
Full-time
Career Level
Principal
Number of Employees
5,001-10,000 employees
