Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. As a Principal RDA and Metrology Engineer in APTD, you will be primarily responsible for creating, developing, and optimizing Assembly Stacking, wafer level packaging, defect detection, and metrology methods to develop next generation products. Successful candidates will exhibit strong logic and analytical problem-solving thought processes, approaching them with a " How can I resolve this today? " mindset. We are seeking someone who can efficiently organize multifunctional teams to complete projects and solve an array of problems, coordinate meetings, and initiate follow-up actions with a " How will I make a difference today?" approach.
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Job Type
Full-time
Career Level
Principal
Number of Employees
5,001-10,000 employees