Principal Photonics Integrated Circuit Design Engineer

RTX•San Diego, CA

2d•Onsite

About The Position

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world. Raytheon is seeking a talented and motivated Principal Photonics Integrated Circuit Design Engineer to join our Surface Radars and Sensors Center within the Systems Engineering and Test Capabilities (SETC) Discipline, supporting Advanced Technology (AT) Programs. In this role, you will be responsible for the design, modeling, layout, post-fabrication assembly, sub-system assembly, and benchtop test of RF integrated photonics (PIC) devices/components, subsystems, and systems in support of research and development programs. You will collaborate with senior engineers across technical disciplines within Raytheon programs.

Requirements

Typically requires a Bachelor’s in Science, Technology, Engineering, or Mathematics (STEM) and 8 years of prior relevant experience.
Experience in designing integrated photonic circuits and/or photonic chips.
The ability to obtain and maintain a U.S. government issued security clearance is required.
U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance
Active and existing security clearance required after day 1

Nice To Haves

Advanced degree (MS or PhD) in Physics, Optics, Photonics, Circuits, Signal Processing, or related engineering fields.
Hands-on experience with Silicon photonics platforms and integrated photonics technologies (Silicon, Silicon Nitride, and/or compound semiconductors).
In-depth understanding of foundry-based fabrication processes and constraints impacting integrated photonic device performance.
Proficiency in photonic design and simulation tools (e.g., Ansys Lumerical, Synopsys Optocompiler, KLayout, etc.).
Experience in developing and executing test plans for integrated photonic devices and subsystems.
Familiarity with microelectronic and photonic integrated circuit packaging technologies.
Strong communication skills in verbal, written, and presentation formats.
Demonstrated proactive problem-solving skills.
Proven ability to work effectively in a collaborative team environment.

Responsibilities

Initiate and contribute to the design, simulation/modeling, and layout of integrated photonic components in foundry-based fabrication environment.
Contribute to post-fabrication post-processing/assembly, test setup, and benchtop test of integrated photonic components, subsystems, and systems in coordination with senior technical and program leadership.
Conduct architectural trade studies on various systems and sub-systems related to wideband RF and hybrid electronic-photonic components and sub-systems.
Contribute to the technical volume for white papers and proposals, as well as contribute to independent research and development (IRAD) projects for the advancement of hybrid electronic-photonics components and sub-systems.
Be accountable for technical decisions.
Communicate and collaborate with Program Management and Technical Leadership, Engineering Leadership, Manufacturing, Suppliers, and Customers.