Silicon Photonics Integrated Circuit Design Engineer / Tech Lead

Teklysium Inc•San Jose, CA

16h•Hybrid

About The Position

Client is building advanced silicon photonics and heterogeneous photonics technologies for next-generation compute, connectivity, and sensing platforms. We are looking for strong builders who want meaningful technical ownership, broad scope, and the opportunity to help shape a core platform from an early stage. Role Summary Client is hiring a hands-on Silicon Photonics Integrated Circuit Engineer / Tech Lead to lead PIC device design, simulation, layout, tapeout preparation, and validation support for highly integrated photonic ICs. You will work across photonics, electronics, packaging, and test to help deliver manufacturable devices for demanding next-generation systems. This is a high-ownership startup role for someone who wants to move fast under uncertainty, solve hard cross-functional problems, and help build a path from first silicon to advanced high-volume products.

Requirements

Master’s or PhD in Electrical Engineering, Physics, Photonics, Optics, or a related field.
5+ years of hands-on integrated silicon photonics PIC development experience.
Strong understanding of device physics, PIC design principles, and the tradeoffs between performance, manufacturability, and testability.
Proficiency in photonic simulation tools such as Lumerical, RSoft, COMSOL, or equivalent.
Experience with PDK-based layout tools such as KLayout, Cadence, IPKISS, or equivalent.
Ability to work effectively across photonics, electronics, packaging, and test disciplines.

Nice To Haves

Experience with highly integrated PICs and devices such as MRM/MZM, which are used in high-speed communication, optical I/O, or advanced computing/connectivity systems.
Familiarity with heterogeneous integration, including III-V/Si or other active-device integration approaches.
Experience related to dense WDM integration, integrated light sources, transceiver-class PICs such as co-packaged optics or pluggable.
MPW or production tapeout-to-silicon experience and post-silicon iteration.
Exposure to packaging, thermal design, reliability, and the requirements of advanced-volume products.

Responsibilities

Design and optimize passive and active PIC building blocks, including waveguides, couplers, MMIs, grating couplers, modulators, detectors, heaters, and related structures.
Contribute to subsystem- and chip-level design decisions for dense photonic integration, wavelength-division architectures, and tightly integrated optical I/O functions.
Run photonic, thermal, and tolerance/yield simulations and translate results into design rules, margins, and practical engineering tradeoffs.
Work closely with electronics teams and external partners on ASIC/PIC co-design, interfaces, packaging constraints, and test access.
Convert schematics and design intent into DRC-clean layouts using foundry PDKs and disciplined layout practices.
Manage layout hierarchy, verification flows, DRC/LVS checks, fill and density rules, and mask readiness.
Prepare GDS and tapeout documentation packages, including structures that improve debug, characterization, and revision speed.
Define test structures, test plans, and acceptance criteria for first-silicon learning and design iteration.
Analyze electro-optic and optical measurement data, support debug, and drive model updates and design improvements.
Help build a practical path toward robust, manufacturable, and reliable products, with attention to thermal behavior, yield, and scale.