Principal Packaging Engineer

Empower Semiconductor • Milpitas, CA

6d • Onsite

About The Position

Break free from legacy packaging constraints and push the limits of power delivery. At Empower Semiconductor, we are redefining how power is delivered to the world’s most demanding AI processors through ultra-high-frequency, ultra-high-density power converters built on advanced semiconductor technologies. Based in Silicon Valley, Empower is a power management technology leader at the forefront of the AI, HPC and data-center applications. We are seeking a talented and experienced Packaging Engineer to join our R&D team in Milpitas, California, and lead the development of next-generation power packaging solutions. In this role, you will architect, develop, and optimize advanced package-level power delivery systems from concept through high-volume production, with deep ownership of electrical, thermal, and mechanical co-design. You will work cross-functionally with silicon design, process technology, reliability, manufacturing, and systems teams to deliver industry-first solutions that fundamentally challenge conventional semiconductor packaging and power-delivery limits. If you thrive in a fast-paced, highly collaborative environment and are motivated to solve problems at the edge of physics and manufacturing, this is an opportunity to shape the future of power delivery and advanced semiconductor packaging.

Requirements

• BS Degree in Electrical Engineering, Mechanical Engineering, Material Science.
• Minimum experience 15+ years in semiconductor packaging technology.
• Experience leading multi-die packages.
• Understanding of organic laminate technologies manufacturing and supplier capabilities.
• Experience with package substrate design rules, tools (including AutoCAD)
• Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout
• Extensive experience collaborating with OSAT vendors/suppliers
• Experience in SMT or passive integrated package assembly
• Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation. (Flip Chip is a plus)

Nice To Haves

• Knowledge of AEQ reliability requirements., APQP automotive development process is a plus
• Knowledge of JEDEC/IPC design standards is a plus
• Occasional travel to attend technology reviews and resolve subcon/supplier issues may be required

Responsibilities

• Defining substrate/package design rules, process flows and material sets for new power module packages
• Driving alignment between module substrate design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules
• Developing new assembly technologies, run process DOE’s, define process windows for new package development
• Driving reliability testing and qualification of new packages in conjunction with the reliability function
• Working closely with offshore assembly and substrate partners to develop new processes
• Working closely with IC design teams to define package design rules and define packages to meet their requirements
• Collaborating with multi-functional teams within Empower Semiconductor for successful development, qualification and production ramp of new module products

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 51-100 employees