Principal Engineer - Silicon Packaging Architect

Intel Corp. • Folsom, CA

39d • Hybrid

About The Position

Intel's Central Engineering Group is seeking a Silicon Packaging Architect, responsible for bridging silicon design and advanced packaging to deliver high-performance, cost-effective solutions for next-generation SOCs and DDR PHY interfaces.

Requirements

• Experience in both silicon design (preferably mixed signal/analog) and packaging co-design.
• Background in DDR, SOC, or similar high-speed interface development.
• Hands-on expertise with bump mapping, floor planning, and packaging constraints.
• Proven ability to collaborate across silicon and packaging teams, including risk assessment and simulation.
• Individual contributor or principal engineer level preferred; management experience is not required.
• Experience at leading companies in advanced packaging and PHY design (e.g., Apple, Broadcom, Qualcomm, Micron, AMD, Nvidia).
• Bachelors in electrical engineering, chemical engineering, mechanical engineering, material science or similar field (Master's or Ph.D. preferred).
• 10+ years in silicon and packaging co-design

Nice To Haves

• Familiarity with advanced packaging technologies (hybrid bonding, EMIB, etc.) is a plus but not required.

Responsibilities

• Lead the co-design of silicon and package, focusing on DDR PHY and mixed signal IP integration for server SOCs.
• Design bump maps, floor plans, and manage area constraints for PHYs, collaborating closely with packaging technical experts.
• Conduct hands-on package extractions and simulations (signal integrity, power integrity) to assess package trace and electrical impacts, and perform risk assessments for bump-out strategies.
• Finalize bump-out, floor plan, and area decisions at the end of tech readiness phases.
• Interface with packaging teams on advanced technologies (e.g., C4 bumps, micro bumps, EMIB, hybrid bonding as needed).
• Focus on design, development, and architecture, not process or materials engineering.

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.
• Find more information about all of our Amazing Benefits here: https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003

What This Job Offers

• Job Type: Full-time
• Career Level: Principal
• Industry: Computing Infrastructure Providers, Data Processing, Web Hosting, and Related Services
• Number of Employees: 5,001-10,000 employees