Principal Engineer - Process

Microchip Technology Inc. • Beverly, MA

11d • $75,000 - $232,000

About The Position

Microchip - Frequency & Time Systems (FTS) provides world-class timing solutions and sets the world's standard for time. FTS generates, distributes and applies precise time for telecom, wireless, aerospace/defense, IT infrastructure and metrology industries. FTS's customers, from telecom service providers and network equipment manufacturers to governments and their suppliers worldwide, enabling the ability to build more reliable networks and systems by using the company's advanced timing technologies, atomic clocks, services and solutions. Microchip is seeking an experienced and proactive Process Engineer to support manufacturing and process development of the Chip Scale Atomic Clock. The CSAC is the world's most innovative low-power atomic clock, first introduced in 2011. We are seeking a proactive, enthusiastic, and driven Process Engineer who enjoys working within a team environment. In this role, you will actively contribute to the engineering efforts required for the manufacture of our Chip Scale Atomic Clock. The position requires both electrical, mechanical and chemical engineering competencies and will operate within various engineering disciplines. Role functions will include manufacturing support, materials analysis & definition, production analysis, and process advancement. This role is an experience-rich opportunity for a senior process engineer to work alongside a team of experienced Technicians, Manufacturing Engineers and R&D Engineers. In this fast-paced environment, the selected candidate will quickly integrate within a role characterized as having high levels of autonomy, process development, yield improvement and manufacturing sustainment.

Requirements

• Minimum 10 years of relevant experience with a BS degree, or 5 years with a MS degree.
• Experience with complex new product introduction programs, with a proven ability to multitask, analyze opportunities, define successful approaches, and proactively solve problems.
• Experience in fast pace manufacturing environment
• Experience with hardware bill of materials (BOMs), process documentation, and assembly and test processes
• Experience in Design and Manufacturing in a new product introduction (NPI) role
• Ability to build strong relationships, manage multiple projects simultaneously, and lead cross-functional teams.
• Ability to clearly communicate project requirements and schedules, both verbally and in writing.
• Experience working internationally across multiple time zones and cultures.
• Fluency in utilizing appropriate best-practice engineering principles.
• Ability to travel up to 10% domestically or internationally as required.

Nice To Haves

• Familiarity with statistical methods and concepts such as SPC, ANOVA, 8D, Gage R&R, DOE, 5 Why’s, Fishbone, 6 Sigma, 6S, Lean Value Stream, etc.
• Experience with PLM and ERP software
• MS in Electrical, Mechanical, Chemical, Manufacturing, or Industrial Engineering strongly preferred.

Responsibilities

• Maintain and create detailed SOP’s for different equipment/ processes, including assembly, solder reflowing, sealing, wafer bonding, wafer dicing, evaporation, and sputtering.
• Collect and analyze process data to identify trends and make data-driven decisions while continuously improving and optimizing processes in the physics package product line.
• Provide technical support and training to production teams and end-users for different processes.
• Recommend and implement equipment and process modifications to improve production efficiency, throughput and production yields for new and existing designs.
• Coordinate with suppliers and manufacturers for components procurement, including wafers, VCSELS, photodiodes, solder preforms, thermistors, and LCCs.
• Apply lean manufacturing or Six Sigma methodologies to optimize existing processes for efficiency and cost-effectiveness.
• Establish quality control guidelines, develop testing methods, and ensure compliance with safety and quality standards.
• Ensure compliance with industry standards, environmental regulations, and company policies.
• Provide guidance and training to junior engineers and other staff on process improvements and developments.
• Work on the development and implementation of automated manufacturing processes for assembling semiconductor components.
• Participate and assist in design development of next generation CSAC and support DFM activities.
• Understand and support ERP utilization that is conducive to manufacturing flow and planning.
• Perform failure analysis and drive structured problem solving activities to root cause and corrective action.

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive base pay, restricted stock units, and quarterly bonus payments. In addition to these components, our package includes health benefits that begin day one, retirement savings plans, and an industry leading ESPP program with a 2 year look back feature.
• Benefits of working at Microchip

What This Job Offers

• Job Type: Full-time
• Career Level: Principal
• Number of Employees: 5,001-10,000 employees