Principal Engineer - Packaging

Microchip • San Jose, CA

12d • $70,000 - $163,000

About The Position

We are seeking a highly motivated and experienced Principal Packaging Engineer to join our NPI Packaging team. You will be a member of the FPGA (Field Programmable Gate Array) Business Unit, which is a leader in research, development, and manufacturing of highly reliable non-volatile Field Programmable Gate Arrays. In this role, the candidate will be responsible for advanced semiconductor package development . The ideal candidate will have a background in semiconductor packaging and assembly , and a strong ability to collaborate cross-functionally, solve technical problems, and manage projects.

Requirements

• Bachelor’s or Master’s Degree in Electrical or Mechanical Engineering­­.
• Minimum of 10 years of professional experience, including at least 5 years focused on semiconductor IC packaging.
• Well versed with mid-range pin count packaging solutions, including but not limited to organic and ceramic flip chip BGA/LGA,WLCSP, wire bond BGA, and CSP.
• Strong understanding of materials as related to chip packaging interaction.
• Familiar with wafer BEOL (top metal, passivation, UBM, bumping etc.).
• Strong knowledge of advanced substrate manufacturing/process.
• Knowledgeable in JEDEC, AEC and IPC requirements for component and board level reliability qualification.
• Proven project management, communication, and leadership skills.
• Willingness and ability to grow expertise in multiple disciplines, including manufacturing/quality, materials, electrical, thermal, and mechanical engineering.
• Strong technical skills in resolving customer issues related to IC package quality and reliability
• Travel up to 10% is expected.

Nice To Haves

• Experience with Ansys Electronic Desktop
• Knowledgeable with failure analysis techniques on package technologies
• Experience with Cadence APD and AutoCad for custom substrate design.

Responsibilities

• Co-design packages with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical and thermal requirements of high-performance flip chip packages.
• Work with business unit’s IC design teams to select the optimum package solution on cost, performance, manufacturability, and reliability for new FPGA devices, satisfying business unit’s roadmap for new products.
• Learn and define assembly BOM, process, troubleshoot, and support packaging issues of new advanced technology.
• Create package design documentation and assembly instructions.
• Participate in package technology development and/or other business productivity projects which have broad team impact (e.g. assembly process enhancement, new technology/structure development etc.)
• Manage package qualification for commercial and automotive applications.
• Coordinate with assembly vendors on new packages from development to high volume production.

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive base pay, restricted stock units, and quarterly bonus payments. In addition to these components, our package includes health benefits that begin day one, retirement savings plans, and an industry leading ESPP program with a 2 year look back feature.
• Benefits of working at Microchip
• The annual base salary range for this position, which could be performed in California, is $70,000 - $163,000.

What This Job Offers

• Job Type: Full-time
• Career Level: Principal
• Number of Employees: 5,001-10,000 employees