Principal Digital Design Engineer, HBM

Micron TechnologyRichardson, TX
1d

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal Digital Design Engineer to lead the architecture, design, and delivery of next-generation High Bandwidth Memory (HBM) solutions. This role is a key technical leadership position within the HBM design team, responsible for driving complex digital designs from architecture definition through silicon validation and production. The ideal candidate combines deep hands-on digital build expertise, system-level understanding of HBM architectures, and technical leadership across multi-functional teams, including architecture, verification, physical development, signal integrity, and product engineering.

Requirements

  • Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field.
  • 10+ years of experience in digital IC design, with significant experience in memory or high-speed interface designs.
  • Strong expertise in: SystemVerilog RTL design HBM, DDR, or other high-performance memory architectures Clock‑domain crossing (CDC), reset strategies, and low‑power design Static timing analysis concepts and timing-aware RTL design
  • Proven experience leading complex blocks or subsystems through successful silicon.

Nice To Haves

  • Direct experience with HBM2 / HBM2E / HBM3 or later architectures.
  • Familiarity with: Memory controller scheduling algorithms ECC, RAS, and reliability features Power management and DVFS in memory subsystems
  • Experience with pre-silicon validation platforms (FPGA, emulation).
  • Strong debugging skills across RTL, gate‑level, and silicon.
  • Prior experience mentoring engineers or acting as a technical lead.

Responsibilities

  • Lead digital architecture and micro‑architecture definition for HBM subsystems, including memory controllers, PHY interfaces, command/address logic, scheduling, ECC, and reliability features.
  • Drive architectural tradeoffs across performance, power, area, and reliability (PPA) for advanced HBM generations.
  • Provide technical direction and design reviews for complex RTL and system-level implementations.
  • Own and implement high-quality RTL (SystemVerilog) for critical HBM digital blocks.
  • Ensure robust clocking, reset, low‑power, and DFT-ready design practices.
  • Collaborate closely with physical design teams to ensure timing closure, CDC robustness, and power intent alignment.
  • Support pre-silicon validation, emulation, and post-silicon debug and bring‑up.
  • Analyze silicon results and drive corrective actions across design revisions.

Benefits

  • Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
  • We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
  • Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
  • Additionally, Micron benefits include a robust paid time-off program and paid holidays.
  • For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
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