Principal DFT Design Engineer, HBM

Micron Technology • Richardson, TX

7h

About The Position

Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a DFT Design Engineer, you will work on design, simulation, and validation of next generation High Bandwidth Memory (HBM) architectures and circuit blocks. The HBM DFT Design Engineer is responsible for defining, designing, and integrating Design for Test (DFT) architectures for next generation High Bandwidth Memory (HBM) products. This role ensures robust test coverage across wafer, die, stack, and system in package (SiP) test stages while balancing performance, power, area, and manufacturing cost. The engineer works with multi-functional teams including HBM build, verification, product engineering, test enablement, packaging, and external partners to deliver manufacturable, high quality HBM solutions.

Requirements

• Bachelor’s degree or Master’s degree or equivalent experience in Electrical Engineering, Computer Engineering, or related field.
• Strong fundamentals in digital design and DFT concepts (scan, MBIST, boundary scan, JTAG).
• Experience with RTL design (SystemVerilog/VHDL) and logic integration.
• Familiarity with semiconductor test flows from wafer probe through final test.
• 10+ years DRAM or ASIC DFT Design or Verification experience.

Nice To Haves

• Experience with HBM, DRAM, or advanced memory products.
• Knowledge of TSV‑based 3D integration and stacked‑die test challenges.
• Hands‑on experience with at‑speed test, compression, or advanced DFT methodologies.
• Strong cross‑team communication skills and ability to work in a global, matrixed organization.
• Structured problem‑solving and debug mindset.

Responsibilities

• Define and implement HBM DFT architectures, including scan, MBIST, JTAG/TAP, boundary scan, TSV test, redundancy test, and at‑speed test structures.
• Develop DFT solutions for both base die and DRAM die, considering stacked‑die and cube‑level test requirements.
• Design and integrate test access mechanisms to support wafer probe, cube test, and SiP/system test flows.Driving innovation into the future Memory generations within a dynamic work environment
• Drive high structural and functional test coverage while minimizing area, power, and timing impact.
• Collaborate with Product Engineering and Test Enablement teams to align DFT features with manufacturing test flows and cost targets.
• Collaborate with packaging and interposer teams to ensure DFT compatibility with micro‑bump, TSV, and probe pad strategies.
• Collaborate with external partners and customers to align on custom DFT interfaces and security requirements when applicable.
• Support silicon bring‑up, debug, and qualification activities, including correlation between design intent and manufacturing test results.

Benefits

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

What This Job Offers

• Job Type: Full-time
• Career Level: Principal