About The Position

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet. Qorvo is looking to hire a highly experienced RF design engineer for the position of Principal Design Engineer - RF Modules for a full-time opportunity in the capacity of an individual contributor. Primary role is to own design of RF modules from concept to production release supporting Cellular Base Station, GPS, Radar, Satellite, CATV and other such applications. GaAs HBT and or PHEMT RFIC design skills are preferred.

Requirements

  • MS or PhD in Electrical Engineering or Physics with a focus on RF Design/Electromagnetics.
  • 10+ years of RF module design experience required.
  • Solid understanding of fundamentals of RF/Microwave module design including circuit and electromagnetics level simulations. Good understanding of radio systems and building blocks such as LNAs, PA's, RF switches, attenuators, filters etc. Require very good working knowledge of RF simulation tools such as Keysight ADS, HFSS, AWR (desired). Familiarity with multilayer laminate/PCB layout.
  • Very good theoretical understanding and industry and/or academic hands-on experience with impedance matching techniques and matching circuit design, implementation and test bench level tuning.
  • Ability to create 3D circuit models using EM tools and run simulations on  RF/Microwave structures and translate between the model, simulation, physical implementation, and measured performance required.
  • Good working knowledge of RF test techniques for noise, s-parameters, linearity and lab equipment such as Vector Network Analyzer, Spectrum Analyzer, Oscilloscopes etc.
  • Experience with IPD (Integrated Passive Device) die design for implementing baluns, couplers etc.
  • Must be an excellent results-driven team player, have willingness and ability to learn new skills and technologies.
  • Good written and oral communication skills required.
  • Ability to work effectively and efficiently across diverse engineering, product management, marketing and manufacturing teams.

Nice To Haves

  • Working knowledge of multi-chip module (MCM) packaging processes - soldering, wire bonding, die attach, thermal management etc. Previous experience with passive RF components - filters, couplers etc. - desired. Understanding of MMIC technologies such as GaAs, RF SOI, GaN desired.
  • Exposure to MMIC design highly desired, preference will be given to candidates with GaAs HBT and or PHEMT design background.
  • Previous experience with high rejection/high isolation filter design and implementation is highly desired.
  • Programming experience with Python and/or Matlab especially for Machine Learning highly desired.

Responsibilities

  • Technical ownership of RF module design and development projects from inception to production release; meeting technical performance, schedule and cost goals for NPI (New Product Introduction).
  • Performing circuit level design of RF sub-systems, EM simulations, impedance matching circuits, chain analysis including investigation of variations etc. of RF modules to ensure first pass success of designs.
  • Support preparation of technical proposals to customers.
  • Work closely with project managers to make sure key project milestones are met.
  • Prepare and own internal documentation related to design, prepare and present various technical and project reviews internally and to external customers.
  • Working closely with test engineering personnel to characterize prototypes and product samples, and lead design optimization for performance, yield, reliability and cost.
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