Physical Failure Analysis Technician

Microchip Technology Inc. • Chandler, AZ

5d • Onsite

About The Position

We are seeking an experienced Physical Failure Analysis Technician with 5–10 years of hands-on experience to support semiconductor failure analysis. The ideal candidate will have deep expertise operating a Dual Beam Focused Ion Beam / Scanning Electron Microscope (FIB/SEM) and strong skills in sample preparation techniques to enable accurate root-cause analysis. This role will work closely with failure analysis engineers to analyze physical defects, packaging issues, and structural failures across a variety of device technologies.

Requirements

• 5–10 years of experience in physical failure analysis or related semiconductor/electronics lab environment.
• Expert-level proficiency with Dual Beam FIB/SEM systems
• Strong understanding of semiconductor device structures and electronic packaging.
• Ability to interpret SEM images, cross-sections, and failure signatures.
• Experience with technical documentation and report writing.

Nice To Haves

• Associate’s or Bachelor’s degree in Electronics, Materials Science, Mechanical Engineering, or a related technical field.
• Experience with advanced packaging (BGA, QFN, CSP, flip-chip, wafer-level packaging).
• Familiarity with TEM sample preparation and coordination with TEM analysis.
• Hands-on experience with: Package decapsulation CNC milling X-ray inspection C-SAM analysis

Responsibilities

• Operate and maintain Dual Beam FIB/SEM systems for: Site-specific cross-sectioning Circuit editing TEM lamella preparation Defect localization and characterization
• Perform package decapsulation using chemical, mechanical, laser, and plasma-based techniques.
• Execute precision CNC milling for sample exposure and preparation.
• Conduct X-ray analysis (2D/3D) for non-destructive internal inspection.
• Perform C-SAM (Scanning Acoustic Microscopy) for delamination, void, and crack detection.
• Apply additional sample preparation techniques including: Mechanical polishing ion milling Chemical etching Plasma cleaning
• Document analysis procedures, findings, and results in detailed technical reports.
• Collaborate with engineering teams to support root cause analysis and corrective action development.
• Maintain lab equipment, follow EHS protocols, and support continuous improvement of FA processes.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: Associate degree
• Number of Employees: 5,001-10,000 employees