PCB Rework Technician

Etched • San Jose, CA

1d • Onsite

About The Position

Etched is building the world’s first AI inference system purpose-built for transformers - delivering over 10x higher performance and dramatically lower cost and latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history.
Job Summary
We are seeking a highly skilled PCB Rework Technician with advanced capabilities in large BGA rework (including components >70mm) and complex board-level repairs involving fine-pitch components down to 0402. This role is critical to supporting engineering, validation, and bring-up efforts by performing high-reliability rework on advanced PCBs, including those supporting custom ASICs.

Requirements

• 5 + years of hands-on PCB rework experience on production-quality and/or R&D hardware.
• Proven expertise with large BGAs (> 70 mm), fine-pitch QFNs/BGAs, and 0402-scale components.
• Proficiency using advanced hot-air/IR rework platforms, precision microscopes, and large-area heaters designed for custom ASICs or high-power devices.
• Skill in following detailed engineering rework instructions, layout files, and schematics with minimal supervision.
• Familiarity with IPC-A-610 and IPC-7711/21 workmanship and rework standards.
• Exceptional attention to detail, steady manual dexterity, and strong visual-inspection skills.
• Comfort working in a fast-paced, evolving R&D environment where requirements can change quickly.

Nice To Haves

• Operating and programming X-ray or AOI systems for real-time inspection and failure analysis.
• Performing micro-soldering, trace repair, and circuit rerouting on high-density, multi-layer boards.
• Reballing custom ASIC packages and handling ultra-large, high-pin-count ICs.
• Developing or optimizing thermal profiles for challenging package types (e.g., stacked dies, high-power BGAs).
• Documenting rework processes in MES/PLM systems and feeding back design-for-rework (DFR) recommendations.
• Supporting engineering bring-up with rapid component swaps, blue-wire fixes, and on-the-fly design experiments.

Responsibilities

• Perform precision rework and re-balling of very-large BGAs (custom ASIC packages > 70 mm) with high first-pass yield.
• Operate large-format BGA rework systems, ensuring exact alignment, controlled thermal profiles, and clean re-flow on high-pin-count ICs.
• Rework SMT and through-hole components down to 0402 packages, maintaining exceptional workmanship and consistency across boards.
• Read and interpret ECNs, schematics, layout files, and BOMs to execute component swaps and design modifications accurately.
• Execute advanced board-level repairs: trace cuts, jumper-wire additions, micro-soldering, and circuit rerouting.
• Inspect reworked assemblies with X-ray or AOI equipment to verify solder-joint integrity, alignment, and overall quality.
• Maintain detailed rework documentation and clearly communicate findings or improvement ideas to engineers.
• Collaborate closely with hardware, validation, and bring-up teams to support rapid iteration and tight project timelines.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: No Education Listed