PCB Fabrication Process Engineer

Advanced Micro Devices, Inc•Austin, TX

About The Position

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. We are looking for a talented and energetic Lead Printed Circuit Board (PCB) fabrication process engineer to complement the existing skillsets of our Platform development team. In this role, you will be responsible for driving PCB performance, quality and reliability specifications: including but not limited to high-speed signal & power integrity (SI/PI) optimized stacks and interconnect structures for volume manufacturing. To accomplish this, you will interact frequently with key teams leading silicon/package design, board schematics/layout engineering, system validation, device failure analysis and supply chain/procurement activities within AMD, external industry consortiums, our customer teams, and strategic ODM & joint development partners. As a Leader in Systems Design Engineering, you will be responsible for ensuring best-in-class performance and reliability of cutting-edge PCB designs. The suitable candidate will require a strong background & solid understanding of complex fabrication processes, high performance electronics hardware, and technical expertise in assembly reliability test/failure analyses. Effective communication skills, a collaborative mindset, detail-orientation, innovative critical problem solving/ troubleshooting, and organized data collection are critical qualities for success in this role.

Requirements

Strong background in high-speed design, robust strategies for PCIe & Memory routing, and optimal PCB material selection dependent on application end-use
Expertise in destructive and non-destructive PCB failure/root cause analyses using 3DXRM, SEM, Thermal analysis (DSC, DMA...etc.), and FTIR Spectroscopy
Familiarity with 2D/3D Allegro (or other) Stack Impedance and Loss simulation tools required for SI/PI-focused interconnect optimizations
Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for statistical data analysis & tool development
Excellent verbal & written communication skills at engineering and executive levels, including a proven track record of working effectively across organizational boundaries to define process requirements, solve complex problems and drive program-related investigations to successful completion
Laboratory Acumen - Experience with Design of Experiments, instrumentation, data acquisition and analyses, including uncertainty analysis
PCB Manufacturing - Sound knowledge of design & fabrication guidelines, in-depth understanding of PCBA-related failure mechanisms including CAF, PTH/via cracking, pad cratering/solder ball stress, glass-stop & delamination risk and proven experience with volume manufacturing suppliers in Asia & North America
Required - Bachelor's degree in Engineering (Electrical/Computer/Mechanical/Chemical…etc.)

Nice To Haves

Preferred - Master's degree in Electrical/Electronics & Computer Engineering

Responsibilities

Design high performance material stacks & complex via-structure interconnects to enable AMD's next generation of Datacenter GPU Platform PCBs
Effectively address/close Design for Manufacturing queries in a timely manner to mitigate fabrication yield issues & derisk on-schedule delivery of critical builds
Own the process qualification & adoption of PCB fabrication technologies required to address rapidly evolving Signal Integrity, Power Delivery, and Thermal-Mechanical related performance specifications
Define technology roadmaps, vendor engagements, and help implement robust architecture design practices for performance, cost, and manufacturability
Collaborate with silicon/package design, board engineering/layout, and other cross-functional teams to enable PCB solutions from package to system level
Contribute to overall Platform quality from conceptualization/feasibility planning stage through NPI & mass volume production ramp
Drive process improvements while executing fast time-to-market product delivery
Function decisively in a dynamic & fast-paced product development environment