Packaging Module Development Engineer

Intel Corporation • Hillsboro, OR

1d • Hybrid

About The Position

As a Packaging Module Development Engineer, you will be a vital contributor to Intel's mission to deliver cutting-edge technology to the world. In this role, you will play a key part in developing innovative packaging solutions that enable the next generation of Intel products. Your contributions will significantly impact the reliability, performance, and design of advanced packaging technologies, driving Intel's leadership in the semiconductor industry. Working closely with cross-disciplinary teams, you will have the opportunity to influence product development and bring impactful ideas to life in a forward-thinking environment.

Requirements

• Bachelor's degree in Mechanical Engineering, Material Science, or a related STEM field.
• 4 or more years of experience in packaging design, development, or related areas.
• 1 + years of experience with socket and connector in packaging development.
• 1 + years of familiarity with surface mount techniques and packaging mechanics.

Nice To Haves

• Master's or Ph.D. in Mechanical Engineering, Material Science, or related disciplines.
• Strong technical knowledge of mechanical design principles and reliability modeling.
• 1 + years of proficiency in finite element analysis tools (ABAQUS, ANSYS, COMSOL) and methods.
• Expertise in geometric dimensioning and tolerancing and tolerance analysis.
• Demonstrated ability to effectively communicate and collaborate across multidisciplinary teams.
• Experience with innovative packaging projects and driving solutions in dynamic environments.
• Proven ability to resolve complex challenges and deliver impactful results through strategic problem-solving.

Responsibilities

• Design and develop advanced packaging solutions, ensuring alignment with performance, reliability, and quality standards.
• Collaborate with cross-functional teams to optimize package architecture and designs for product integration.
• Conduct finite element analyses and reliability modeling to evaluate packaging performance and ensure robustness.
• Apply geometric dimensioning and tolerancing principles to achieve precision in mechanical design and tolerance analysis.
• Support the integration of sockets and connectors into packaging designs, maintaining high-level functionality and manufacturability.
• Drive quality assurance processes and reliability measurements to mitigate risks and ensure product success.
• Leverage surface mount and mechanical design techniques to innovate and refine packaging modules that meet industry standards.
• Solve complex technical challenges related to packaging mechanics and deliver solutions that align with Intel's product roadmap.

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level