P/T Temporary Packaging Engineering Technician 2 (Irvine, CA, US)

Skyworks Solutions, Inc. • Irvine, CA

37d

About The Position

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates. We are seeking a Temporary Materials/Engineering Technician with hands-on experience in cross-section preparation and analysis, semiconductor packaging, and Assembly manufacturing processes. The ideal candidate will support product development, and root cause investigations through detailed material and structural analysis of electronic assemblies.

Requirements

• Position requires a minimum AA and 1-2 years' experience in materials characterization and semiconductor packaging. Or, BA in Electrical Engineering, Material Science, Physics or equivalent disciplines (no experience required).
• Excellent problem- solving, documentation, and communication skills.

Nice To Haves

• Knowledge of encapsulation, underfill, wire bonding, and flip-chip packaging.
• Proficiency with failure analysis software and data management tools.
• Fluency in MS Office Suite
• Hands-on experience with cross-section preparation, SEM/EDX analysis, and metallography.
• Working knowledge of semiconductor device structures, solder metallurgy, PCB fabrication, and SMT assembly processes.
• Support failure analysis (FA) for components, substrates, solder joints, vias, and multilayer boards.

Responsibilities

• Supports engineering activities such as
• Perform cross-section sample preparation on semiconductor devices using mechanical polishing.
• Conduct optical microscopy, SEM/EDX, and X-ray inspection to analyze materials, defects, and interfaces.
• Collaborate with process, design, and quality engineering teams to drive corrective actions and continuous improvement.
• Maintain and calibrate laboratory tools such as cross-section polishers and imaging systems.
• Document analysis results through detailed technical reports and presentations.

What This Job Offers

• Job Type: Part-time
• Career Level: Entry Level
• Industry: Computer and Electronic Product Manufacturing
• Education Level: Associate degree
• Number of Employees: 1,001-5,000 employees