Package Development, Signal Integrity and Power Integrity Engineer, Senior Principal

Marvell Technology•Santa Clara, CA

About The Position

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact The Marvell Advanced Packaging team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Many of the new designs require multi-chip, multiple component configurations involving, but not limited to, 2.5D and 3D packages, Co-packaged copper or optics and advanced substrates. Marvell has partnered with the world's leading manufacturers to solve our customer’s most challenging designs and integrations with industry-leading packaging technologies What You Can Expect Leverage strong knowledge of developing complex systems like switches, accelerators, AEC and optics to architect complex future package developments Proven track record of new product introduction from concept, through development and production Proven track record of technical leadership in the organization Ability to interact with customers, understand their requirements and develop packaging solutions meeting or exceeding customer expectations Experience with 2.5D/3D package development is highly desired Familiarity with packaging technologies, materials, package substrate design rules and assembly rules Drive netlists for the package development with tools like ISP (Integrated System Planner) or equivalent tools (XSI or others) Experience with developing systems with high-speed interfaces like DDR, SERDES and Die2Die interfaces Strong understanding of Signal and Power Integrity, and EMC issues for IC packages, PCBs and connectors Knowledge of the thermal and mechanical issues of the IC package development Ability to work with and drive engineers from different disciplines (SI, PI, Pkg architecture, System design, Assembly, Thermal & Mechanical engineers) to develop market leading packaging solutions Working knowledge of solving and debugging issues in the lab for high-speed systems Strong communication, presentation, and documentation skills A team player

Requirements

Leverage strong knowledge of developing complex systems like switches, accelerators, AEC and optics to architect complex future package developments
Proven track record of new product introduction from concept, through development and production
Proven track record of technical leadership in the organization
Ability to interact with customers, understand their requirements and develop packaging solutions meeting or exceeding customer expectations
Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
Drive netlists for the package development with tools like ISP (Integrated System Planner) or equivalent tools (XSI or others)
Experience with developing systems with high-speed interfaces like DDR, SERDES and Die2Die interfaces
Strong understanding of Signal and Power Integrity, and EMC issues for IC packages, PCBs and connectors
Knowledge of the thermal and mechanical issues of the IC package development
Ability to work with and drive engineers from different disciplines (SI, PI, Pkg architecture, System design, Assembly, Thermal & Mechanical engineers) to develop market leading packaging solutions
Working knowledge of solving and debugging issues in the lab for high-speed systems
Strong communication, presentation, and documentation skills
A team player
Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 15-20 years of related professional experience.
Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 12-18 years of experience