PA Design Engineering Intern

QorvoChandler, AZ
62d$31 - $42

About The Position

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.Qorvo’s Internship Program is designed for college students currently enrolled in an accredited Bachelor’s, Master’s, or PhD program. Qorvo offers real work experience, exposure to upper management, and the opportunity to pursue full-time opportunities, as available. Qorvo’s Internship Program offers: Challenging, skill-building assignments Mentoring and coaching from industry experts Launch & Learns and other learning opportunities Collaborative team-based work environment Networking and social events Final presentation to business leaders Qorvo’s PA Design Engineering Internships are offered in our Advanced Cellular business group. Specific projects and responsibilities will be determined based on the business needs at the time of the internship assignment.

Requirements

  • Currently pursuing a MS or PhD in Electrical Engineering or Applied Physics
  • Minimum GPA of 3.0
  • Analog/RF circuit design coursework and/or experience
  • Strong written and verbal communication skills to convey complex technical information
  • Detail oriented to ensure design and delivery of high yielding products
  • Ability to enjoy working in fast paced work environment

Nice To Haves

  • Electromagnetic and/or Microwave Engineering coursework and/or experience is a plus
  • Exposure to RF measurement equipment such as spectrum analyzers and network analyzers preferred
  • Software exposure: Cadence, ADS, FEM, HFSS, Momentum, Cadence. Electro-thermal simulation is a plus
  • Proficiency with Microsoft Office (Excel, Word, PowerPoint)

Responsibilities

  • Designing power amplifiers and supporting power amplifier development for RF modules used in wireless communication applications
  • Performing schematic capture, circuit simulations, and layout of RF PA integrated circuits, modules, and evaluation boards
  • Validating PA design and module layout performance with 2D or 3D EM modeling
  • Meeting performance requirements while also considering size, cost, footprint, and schedule
  • Producing designs with increasing complexity from customer demands for 5G, LTE, carrier aggregation, multiple antennas, filters, and power management
  • Adapting to new customer requirements for ruggedness, ESD, and quality
  • Working with signal generators, spectrum analyzers, network analyzers, and power meters to compare simulated data to real lab data
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