Assembler-Micro Assembler

Macom S.A.S.•Hamilton Township, NJ

56d•$25 - $28•Onsite

About The Position

Micro assembly usingmanual die attach with conductive epoxy, wedge wire bonding and parallel gapwelding techniques necessary in manufacturing high frequency RF products.

Requirements

Ability to work effectively with team of operators, process engineers and managers towards a common goal.
Ability to read and understand equipment manuals, operation procedures.
Excellent attention to detail.
Proficient in use of microscope, tweezers, epoxy mounting, die mounting procedures.
Strong oral comprehension and expression to understand and communicate ideas.
Efficient time management skills.
Experience in use of wire bonder and welding machine.
Near vision, ability to focus and see detail.
Finger dexterity, ability to grasp and manipulate small parts.
Hand/eye coordination, ability to hold and control equipment.
Assembly line work indoors in an environmentally controlled environment.
High School degree/GED.
Minimum 2 years assembly experience.
Must complete a skill evaluation replicating required job function during interview.
Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

Responsibilities

Prepare components for standard micro assembly.
Perform rework and repair operations on electronic parts to correct defects and ensure conformance to specifications.
Follow established Quality Assurance Standards to inspect in process electrical, RF microwave or mechanical components/assemblies by microscope.
Read and interpret assembly drawings.
Train, explain procedures and techniques to other assemblers.
Confer with supervisors, test technicians, engineers and quality to plan or review work activities or to resolve production problems.
Perform other duties as assigned.
Duties and responsibilities may change, or new ones may be assigned at any time, with or without notice.