You will be partnering with and leveraging domain experts across various areas of technology development, EDA vendors and product design teams to develop and deliver high-quality industry-leading memory technology collaterals and to drive circuit innovations that enable next generation high-performance, high-density, low-power embedded memory designs on Intel advanced CMOS process technologies. In this position your responsibilities will include, but may not be limited to: Memory pathfinding activities and power, performance and area (PPA) optimization through design technology co-optimization (DTCO) and product design enablement. Memory bit-cell and complex periphery IC layout and automation. Memory array/IP design, memory circuit innovation, test-chip design. Pre-Si verification, post-Si validation and debugging to enable yield and parametric tracking/ramp. The Advanced Design (AD) team is part of Intel's larger Design Technology Platform (DTP) Organization and is focused on pathfinding and development of advanced memory technology. These circuits enable best-in-class memory collateral, IP and innovative product design across all generations of Intel process technology. At Intel, DTP is one of the key pillars enabling Intel to deliver winning products in the marketplace. Your work will directly enable Intel's internal and external customers to get to the market faster with products that include high-performance, high-density, low-power memory at the leading edge of the technology curve and implemented in Intel's advanced CMOS process technologies.
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Job Type
Full-time
Career Level
Mid Level