Mechanical Engineer: RF Subsystems II

HRL Laboratories • Calabasas, CA

1d

About The Position

The ideal candidate will contribute technical expertise and work within a fast-paced team of scientists and engineers on the development of next generation RF/mmWave Subsystems. Candidate will be expected to work within diverse teams taking responsibility for the design, FEA modeling, implementation, and integration of mechanical and thermal solutions for advanced RF prototypes.

Requirements

• Must be proficient with SolidWorks to create detailed 3D models and technical drawings of components and assemblies
• General knowledge of GD&T is required and how it relates to processing methods
• Experience with FEA analysis tools such as Ansys or COMSOL
• At least 4 years of experience designing, implementing, and testing mechanical assemblies and/or thermal management systems
• Working knowledge of mechanical and thermal design principles from the component to subsystem level, including operation, controls, safety, etc.
• Understanding of structural and thermal analysis and fluid dynamics
• Familiarity with MILSPEC standards and qualification of hardware for DoD applications
• Proficiency in use of computers, engineering workstations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment.
• Ability to work well in a team and independently
• Understanding of ASME Y14.5. and ASME Y14.100 is a plus.
• Basic understanding of electronic and/or RF systems is a plus.
• Understanding of RF components and devices
• Working knowledge of electronic parts and components, including connectors, cables, printed circuit boards and device packages
• Product life cycle, vibration, environmental testing experience is a plus.
• US citizenship and ability to obtain and maintain US Government security clearance

Responsibilities

• Work with RF and electrical engineering teams to design mechanical and thermal assemblies to meet customer requirements.
• Perform thermal and structural analysis of mechanical assemblies and thermal management systems for electronics and RF subsystems
• Lead the development of mechanical assemblies and thermal management systems from design through fabrication, integration and testing.
• Prepare comprehensive documentation including design specifications, component drawings, assembly drawings, tolerance analysis and interface control documents with application of GD&T
• Support design reviews and implement design for manufacturing principles.
• Perform or oversee fabrication and testing of assemblies.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 1,001-5,000 employees