Lead Product Manager, AI Storage Solutions

Sandisk • Milpitas, CA

10d

About The Position

ESSENTIAL DUTIES AND RESPONSIBILITIES: As a Lead Product Manager , AI Storage Solutions you will define the strategic vision, roadmap, and execution plan for next‑generation memory solutions that enable cutting‑edge AI , Machine Learning , and High‑Performance Computing ecosystems. You will serve as the connective tissue across engineering, marketing, operations, and hyperscale customers—driving competitive differentiation and business growth for high‑performance memory products. Key Responsibilities Strategic Product Leadership Own the multi‑year product roadmap , aligning with technology inflection points such as AI Storage Solutions, and emerging AI Storage Solutions architectures. Translate market dynamics, customer signals, and competitive insights into product requirements (MRD/PRD). Customer & Market Engagement Lead deep technical engagements with hyperscalers and chipmakers (e.g., NVIDIA, AMD), turning customer performance, latency, and capacity needs into engineering deliverables. Position product solutions for AI inference, KV‑cache, and memory‑centric architectures informed by industry trends, inference context memory, KV‑tiering. Business & Financial Ownership Build business cases including TAM/SAM/SOM models, pricing strategies, investment requirements, and ROI modeling. Guide lifecycle execution from concept → development → through cross‑functional program reviews (Stage Gate). Execution & Cross‑Functional Leadership Partner closely with ASIC, firmware, NAND, system, and quality teams to drive technical readiness and performance targets. Manage supplier relationships and work with supply chain to ensure cost, yield, and delivery success. Coordinate internal alignment with engineering, reliability, operations, and exec staff. Competitive Intelligence Maintain a robust understanding of the semiconductor memory landscape—AI Storage Solutions competition, NAND‑AI Storage Solutions, emerging AI architectures, and customer platform roadmaps. Technical Expertise Strong understanding of: 3D stacking / TSV Memory–accelerator integration (AI/ML GPU pipelines) Memory subsystem architecture and performance analysis AI Storage Solutions, NAND‑based high‑bandwidth architectures

Requirements

• Bachelor’s degree in Electrical Engineering, Computer Science, Engineering, or related field.
• Minimum of 8+ years of experience in product management
• Minimum of 2 years experience in AI Architectures for datacenters or on-device
• Strong desire to take ownership of the full product lifecycle
• Proven track record of managing and launching successful emerging technology products.
• Deep understanding of flash memory technology and AI Storage Solutions, 3D stacking, TSV architectures.
• NAND-based high bandwidth architectures.

Nice To Haves

• MBA preferred.
• Any knowledge of AI software stack will be a added advantage.
• Strong analytical and strategic thinking skills, with the ability to translate market trends into actionable product strategies.
• Excellent leadership and communication skills, with experience leading cross-functional teams.
• Experience presenting to senior level audiences
• This is an Individual contributor (IC) role. Any people management skills will be an added advantage

Responsibilities

• Own the multi‑year product roadmap , aligning with technology inflection points such as AI Storage Solutions, and emerging AI Storage Solutions architectures.
• Translate market dynamics, customer signals, and competitive insights into product requirements (MRD/PRD).
• Lead deep technical engagements with hyperscalers and chipmakers (e.g., NVIDIA, AMD), turning customer performance, latency, and capacity needs into engineering deliverables.
• Position product solutions for AI inference, KV‑cache, and memory‑centric architectures informed by industry trends, inference context memory, KV‑tiering.
• Build business cases including TAM/SAM/SOM models, pricing strategies, investment requirements, and ROI modeling.
• Guide lifecycle execution from concept → development → through cross‑functional program reviews (Stage Gate).
• Partner closely with ASIC, firmware, NAND, system, and quality teams to drive technical readiness and performance targets.
• Manage supplier relationships and work with supply chain to ensure cost, yield, and delivery success.
• Coordinate internal alignment with engineering, reliability, operations, and exec staff.
• Maintain a robust understanding of the semiconductor memory landscape—AI Storage Solutions competition, NAND‑AI Storage Solutions, emerging AI architectures, and customer platform roadmaps.
• Strong understanding of: 3D stacking / TSV Memory–accelerator integration (AI/ML GPU pipelines) Memory subsystem architecture and performance analysis AI Storage Solutions, NAND‑based high‑bandwidth architectures

Benefits

• You will be eligible to participate in Sandisk's Short-Term Incentive (STI) Plan, which provides incentive awards based on Company and individual performance.
• Depending on your role and your performance, you may be eligible to participate in our annual Long-Term Incentive (LTI) program, which consists of restricted stock units (RSUs) or cash equivalents, pursuant to the terms of the LTI plan.
• RSU awards are also available to eligible new hires, subject to Sandisk's Standard Terms and Conditions for Restricted Stock Unit Awards.
• We offer a comprehensive package of benefits including paid vacation time; paid sick leave; medical/dental/vision insurance; life, accident and disability insurance; tax-advantaged flexible spending and health savings accounts; employee assistance program; other voluntary benefit programs such as supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity; tuition reimbursement; transit; the Applause Program, employee stock purchase plan, and the Sandisk's Savings 401(k) Plan.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level