Lead of Thermal Systems & Simulation (Semiconductor)

Flexcompute Inc.•Watertown, MA

About The Position

Flexcompute is an early-stage technology startup that develops ultra-fast simulation technology to help companies to design and optimize technology products. Our award-winning products are used to design airplanes, wind turbines, quantum computing chips, VR/AR headsets, data centers, and smartphones. Our team consists of world-renowned experts in scientific computing, and we have a global team working remotely from Europe, Asia, North and South America. The Mission The semiconductor industry is hitting a “thermal wall.” As chip power densities exceed 1000W, traditional design cycles are too slow to keep up. Flexcompute is looking for a visionary Lead to spearhead our entry into the chip cooling industry. You will use our proprietary, high-performance physics simulation technology to help customers design the next generation of liquid cooling, immersion systems, and advanced heat sinks for AI and HPC hardware.

Requirements

PhD or MS in Mechanical Engineering, Applied Physics, or a related field with a focus on Heat Transfer and Fluid Dynamics.
8+ years in thermal management for electronics. You have likely led thermal architecture for high-TDP processors or high-performance server systems.
Expert-level proficiency in thermal simulation tools. You must understand the underlying physics well enough to articulate why a GPU-accelerated or novel solver approach is transformative.
Deep familiarity with the roadmap of AI hardware, OCP (Open Compute Project) standards, and the transition from air to liquid cooling.

Nice To Haves

You are frustrated by the slow turnaround times of current CAE software.
You have the network to open doors at major foundries and data center equipment manufacturers.

Responsibilities

Strategy & Product Roadmap: Define how Flexcompute’s solver technology can be optimized for thermal management, including microfluidics, phase-change materials, and 3D IC packaging.
Technical Leadership: Act as the primary subject matter expert (SME) for chip cooling, bridging the gap between our internal solver developers and external hardware architects.
Solution Architecting: Work directly with Tier 1 semiconductor companies and Hyperscalers to solve complex thermal challenges using Flexcompute’s simulation platform.
Market Evangelism: Demonstrate the superiority of our fast-cycle simulation over legacy CFD tools to industry leaders at Nvidia, Intel, TSMC, and cooling specialists.
Team Building: Eventually recruit and mentor a team of thermal application engineers to support our growing portfolio in the semiconductor space.